BANNOCKBURN, IL – IPC published IPC-A-600H, Acceptability of Printed Boards, and IPC-6012C, Qualification and Performance Specification for Rigid Printed Boards.

IPC-A-600H features 95 new and updated photos and illustrations, for a total of 326. The standard offers expanded coverage on topics such as solder mask coverage, etchback, plated-hole wall integrity, via fill, and flexible circuits. It also addresses copper cap-plating of vias and copper-wrap plating.

Criterion for how much a flex circuit can be bent or folded is now available. The document addresses coverlays sometimes used to protect flex circuits.

IPC-6012C addresses determining how many boards and/or test coupons to check. A document used for specifying circuit boards, IPC-6012 details frequency of inspection, instructing how many panels must be examined within a production lot for a given performance class.

Before the completion of the latest revisions, the standards’ next series of enhancements were being planned, including finer geometries, high-density PCBs, the proximity of microvias and stacked microvias that go from one layer to another.

COLLEGE PARK, MD -- DfR Solutions and ARINC have created a partnership to provide reliability and DMSMS support to the commercial government and defense industries.

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BANNOCKBURN, IL — IPC today released J-STD-001E, Requirements for Soldered Electrical and Electronic Assemblies, the culmination of a four-plus year effort to update the industry consensus soldering specification.

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TEMPE, AZ – US manufacturing grew in March for the eighth consecutive month, with the PMI registering 59.6%, up 3.1 percentage points, says the Institute for Supply Management.

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