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Upcoming PCEA PCB Design Training Class for May 2025

Upcoming PCEA PCB Design Training Class for May 2025

PEACHTREE CITY, GA – PCEA Training is offering a five-day Certified Professional Circuit Designer (CPCD) training and certification class Ma...  Read More...

Electronics Unit Drags Down Lacroix's 2024 Sales

Electronics Unit Drags Down Lacroix's 2024 Sales

SAINT-HERBLAIN, FRANCE -- Lacroix reported 2024 revenue of €635.5 million ($686 million), an 8.6% year-over-year decline from 2024 on a like...  Read More...

K&S to Dissolve Electronics Assembly Equipment Unit

K&S to Dissolve Electronics Assembly Equipment Unit

SINGAPORE -- Kulicke Soffa will wind down its electronics assembly equipment business and take charges of up to $100 million as part of a ...  Read More...

ADAC Automotive Acquires EBW Electronics

ADAC Automotive Acquires EBW Electronics

GRAND RAPIDS, MI -- ADAC Automotive today announced the acquisition of EBW Electronics, an electronics design and assembly company.  Read More...

EMS Shipments Rise Again in February

EMS Shipments Rise Again in February

BANNOCKBURN, IL — The 90-day moving average shipments by North American electronics manufacturing services companies rose 1.7% in year-over-...  Read More...

N. American Bare Board B2B Hits High Mark, IPC Says

N. American Bare Board B2B Hits High Mark, IPC Says

BANNOCKBURN, IL — The 90-day moving average shipments among North American printed circuit board fabricators rose 11.3% in February from a y...  Read More...

Semi Fab Equipment Investment Expected to Reach $110B in 2025; Ajit Manocha Comment

Semi Fab Equipment Investment Expected to Reach $110B in 2025; Ajit Manocha Comment

MILPITAS, CA - Global fab equipment spending for front-end facilities in 2025 is anticipated to increase by 2% year-over-year to $110 billio...  Read More...

AR/VR Shipments See Bumpy Forecast, According to IDC; Jitesh Ubrani and Ramon T. Llamas Comment

AR/VR Shipments See Bumpy Forecast, According to IDC; Jitesh Ubrani and Ramon T. Llamas Comment

NEEDHAM, MA – Global shipments for AR/VR headsets grew 10% in 2024, according to new data from IDC. The launch of new products during the ho...  Read More...

NAND Flash Prices to Recover in Q2 as Production Cuts and Inventory Rebuilding Take Effect, Says TrendForce

NAND Flash Prices to Recover in Q2 as Production Cuts and Inventory Rebuilding Take Effect, Says TrendForce

TAIPEI – NAND flash prices are expected to stabilize in the second quarter, while prices for wafers and client SSDs are projected to rise, t...  Read More...

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FEATURES

‘We Try to Take Away All the Barriers’

‘We Try to Take Away All the Barriers’

The market for recycled electronics, and what companies can do with excess stock. Circularity and inventory management intersect two key areas for electronics ...  Read More...

The Art of Corrosion

The Art of Corrosion

An analysis of copper shorting caused by moisture and various residues. Moisture reacts with high levels of weak organic acids, chloride and sulfate residues, ...  Read More...

The Benefits of Nitrogen in PCB Soldering

The Benefits of Nitrogen in PCB Soldering

Introducing nitrogen to the solder process can enhance reliability and yields. Inert gas soldering systems, which use a controlled nitrogen blanket atmosphere ...  Read More...

Is the Industry Ready for a Solderless World?

Is the Industry Ready for a Solderless World?

The time is now for serial inventor Joe Fjelstad’s answer to simplifying component assembly. Joe Fjelstad is a renowned innovator, environmental advocate and t...  Read More...

Keeping Electronics Cool

Keeping Electronics Cool

Types of TIMs and their application methods. As demand for high-performance electronic devices continues to grow, managing heat dissipation effectively has bec...  Read More...

When to Downsize Solder Paste Powders

When to Downsize Solder Paste Powders

Smaller components do not always need a smaller paste. As components shrink in size, the demand for finer solder pastes increases. But the selection of solder ...  Read More...

Royalty Flush

Royalty Flush

A noted solutions architect offers an audacious plan for AI acceptance. It just might work. The talk of AI-based printed circuit design – and the idea that art...  Read More...

Reflow Profiling in PCB Assembly

Reflow Profiling in PCB Assembly

Optimizing temperatures will ensure the best possible conditions for soldering. Verifying and optimizing the temperature profile of a reflow oven ensures an id...  Read More...

Identifying Solder Mask Problems with Simple Tests

Identifying Solder Mask Problems with Simple Tests

Diagnosing sources of crazing, delamination and peeling. In printed circuit board (PCB) assembly, solder mask integrity is paramount. This protective layer, de...  Read More...

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PRODUCTS

BEST Presents StencilQuik BGA Rework Stencil

BEST Presents StencilQuik BGA Rework Stencil

BEST StencilQuik is a custom stencil designed for ball grid array (BGA) and chipscale package (CSP) placement.  Read More...

Yamaha Updates YSUP-PG Programming Module

Yamaha Updates YSUP-PG Programming Module

Yamaha Robotics SMT Section YSUP-PG programming module now features automated programming capabilities said to streamline program generation for all surface-mou...  Read More...

 AGC Multi Material Introduces Reusable Silicone Tape

AGC Multi Material Introduces Reusable Silicone Tape

AGC Multi Material Reusable Silicone Tape is for temporary fixation during SMT processes.  Read More...

Cetec ERP Releases v. 4.16-4.18

Cetec ERP Releases v. 4.16-4.18

Cetec ERP versions 4.16, 4.17, and 4.18 include new features to streamline production, optimize inventory management, and improve communication.  Read More...

Takaya Launches APT-2400F/APT-2600FD Series Flying Probe Tester

Takaya Launches APT-2400F/APT-2600FD Series Flying Probe Tester

Takaya APT-2400F/APT-2600FD Series flying probe, for inspection of high-density circuit boards, has a unique control mechanism and sensing technology and user-f...  Read More...

Yincae Announces UF 158UL Underfill

Yincae Announces UF 158UL Underfill

Yincae UF 158UL underfill is said to fill gaps as small as 10 microns, even in 100x100mm chips.  Read More...

Cybord Unveils Real-Time Interception (RTI) Tool

Cybord Unveils Real-Time Interception (RTI) Tool

Cybord Real-Time Interception (RTI) visual AI-powered software is said to prevent defective components from being assembled on printed circuit board assemblies ...  Read More...

Panasonic Connect Launches NPM-GW Modular Placement Machine

Panasonic Connect Launches NPM-GW Modular Placement Machine

Panasonic Connect NPM-GW modular placement machine features real-time monitoring, predictive maintenance, and enhanced versatility in component handling.  Read More...

Accu-Assembly Introduces AccuCart Smart Rack for Feeders

Accu-Assembly Introduces AccuCart Smart Rack for Feeders

Accu-Assembly AccuCart Smart Rack for Feeders manages feeder management and inventory tracking in surface mount technology (SMT) assembly environments.  Read More...

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