Balver Tip activator is an easy-to-use tool for cleaning oxidized iron soldering tips for SnPb and Pb-free processes. In the simple process, the solder tip is dipped into the solid activator, which becomes liquid and immediately starts removing oxides from the solder tip. After this de-oxidation sequence, the solder tip can be tinned and is ready to create solder joints. Is low smoke and low odor.

Balver Zinn, www.balverzinn.com

CL-100 depaneler for LED boards can handle single-sided, metalized, or FR-4 panels of any length. Uses three sets of round knives positioned at different heights to separate in three sequential steps. Is motor-driven and uses a starting and ending table to lay the panel; operator can feed panel into and through the knives. Table comes in a standard length of 7.8', with 3.5' at the front and 3.5' at the rear. Other length tables are available on request. Can separate boards from 0.8 to 3.5mm in thickness. Max. speed is 400mm/sec. Weighs 45kg.  

Fancort Industries, www.fancort.com

xQR41 MicroDot needle valve features a 60% smaller form factor than standard valves, an exchangeable modular design for greater customization and process control, and a quick release clasp. Is 66mm x 23.7mm and enables multiple valves to be mounted closer together. Reportedly ideal for automated assembly processes, the needle valve can dispense in tighter spaces and at more complex angles. Weighs 141.4g and can be fed from a variety of reservoirs, syringe barrels, external cartridges, or tanks. QR clasp secures fluid body to air actuator and can be removed with a turn of a thumbscrew. Applies micro-deposits as small as 150µm of low- to high-viscosity fluids onto a substrate. Can be configured with stroke adjustable or non-adjustable cap, BackPack valve actuator, low-profile mounting block, and 90° air and fluid inlet fittings. Fluid body can be aligned and locked at 360° intervals to accommodate mounting, positioning, and fluid inlet alignment needs.

Nordson EFD, www.nordsonefd.com

SBX02 alloy has a melting point below 140°C and can be used with peak reflow profiles between 155° and 190°C. Permits through-hole components requiring low peak temperature to be soldered by pin-in-paste low-temperature reflow, eliminating wave soldering. Features mechanical strength, the ability to absorb impact energy and improved drop shock resistance over SnBi0.4Ag alloy. Low voiding in BGA solder joints.

Alpha, alpha.alent.com/en/Solutions/Process/Low-Temperature-Alloys