Products
Optymo 4.4 BoM and parts management software features enhanced quotation module that allows fast sending of RFQs and price and lead-time comparisons. "Min/max" feature now rapidly computes unit and total costs for various quantities of a given BoM, calculates excess costs and remaining components, depending on volumes and packaging. Presents results in graph format. Integrates a relational datase based on a client/server structure. Includes faster data transfer.
Inlynk, www.inlynksoft.com
XP series syringe adapters use 5/32" OD tubing for ease of handling and maneuvering. Permit pressurization of a syringe to dispense a metered amount of material ergonomically and with precision. Come in 3, 5 10, 30, 50cc sizes as well as an option for 6' tubing length. Fits all Jensen Global air syringes as well as many other manufacturers' syringes. Come with standard black quick connect barb fitting or white quick connect fitting that plugs right into novel digital dispenser systems.
Jensen Global, www.jensenglobal.com
Hybrid 3 chip placer has a placement accuracy of less than 10µm, for wafer-level packaging, FOWLP, SiP, MCM, flip-chip, modules and embedded components. Places both die and passive components. Based on high-speed AX/iX product family.
Kulicke & Soffa, www.kns.com
PCB Rax printed circuit board holder is for repair, prototyping and assembly. Is designed to hold odd-shaped boards, even round ones. Accessory slots (open T-slots, allow the addition of various accessories. Customizable. Uses standard connecting hardware. 
PCB Rax, www.kickstarter.com/projects/1428014401/pcb-rax-an-easy-to-use-circuit-board-holding-syste
RACS (reducing agent: coke substitute) waste reprocessing technology processes contaminated trash into a carbon-rich reducing agent used to make pure metals and profits from dross and oxides. Waste stream is generally comprised of understencil wipes, spent paste, tubes and jars, gloves, rags, finger cots, and other similar items.
Conecsus, www.conecsusllc.com
CA-180 low-temperature cure conductive adhesive is for die attach and general circuit assembly applications. Cures in 30 min. at 80°C, three min. at 100°C, or 10 sec. at 150°C with an electrical conductivity of 4 x 10-5ohm-cm. Reportedly ideal for applications in which components are temperature-sensitive and require high conductivity interconnects. Has a 48-hr. work life and a 12,000 cP viscosity at 5 rpm. Was developed to pass reliability requirements in die attach, disk drive, camera module, photonics and circuit assembly applications.
Engineered Material Systems, www.emsadhesives.com
