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Loctite 3508 is a Cornerbond underfill system designed for CSPs and BGAs in Pb-free environments. Benefits reportedly include higher throughput, reduced manufacturing costs and improved pot life. Is a one-component epoxy cornerfill engineered for process optimization with curing taking place during normal Pb-free solder reflow. Said to permit component self-alignment. Is preapplied to the board at the corners of the CSP pad site using a standard dispensing system. Has six-month shelf life, a pot life greater than 75 hours, and can be stored under standard refrigeration. Other advantages reportedly include improved adhesive strength over previous versions and a reworkable feature that enables defective components to be removed. 
 
Henkel Corporation, www.electronics.henkel.com
PADS2007 is said to offer the ability to implement RF and microwave circuitry using automated functionality and perform design for fabrication (DFF) checking early in the design process. Enhancements include high-speed analysis/verification functionality; controls for matched length nets and differential routing improvements; square and chamfered corners; DXF-in import, and via matrixing enhancements for RF design. Designs with partial vias (blind or buried) are automatically updated with the layer pairs and drill count of the partial vias in the design; alpha-numeric pin improvements simplify creation of large BGA-based parts; ECO enhancements include comparison of design rules between the schematic and layout databases. Fabrication checks, such as acid trap, starved thermals, solder mask slivers are checked in the CAD environment and database. Can turn on/off the visibility of the component pin numbers. Integration of DxDesigner and the HyperLynx LineSim tool.

Mentor Graphics Corporation, www.mentor.com  
The automatic Snuf-Bak dispense valve is said to be ideal for high-volume fluid control and fast shut-off of viscous materials such as polyurethanes, epoxies, silicones, greases and various cohesive and thixotropic adhesives and sealants. The pneumatically actuated valve opens and closes its material passage in the base of the nozzle adapter to start and stop material flow. The needle pulls backward during shutoff to prevent stringing. Material is delivered by either a metering assembly or from supply pumps or tanks. Precise volume reportedly is dispensed by a precision shot-meter, timer control panel or trigger-on time remote signal. Is designed with two 3/8" NPT and two 3/4" NPT inlet ports to adapt to nearly any hose or pipe size. The 1/2" NPT outlet port accepts standard or custom plastic or metal dispense nozzles. Has multiple mounting methods, including dual screw and dowel and slide bracket fixturing.

Sealant Equipment & Engineering Inc., www.SealantEquipment.com
The Stablo EX two-way ionizer reportedly generates a balanced mix of positively and negatively charged ions that eliminate static on lab samples, allowing them to be weighed accurately with high repeatability. Uses AC voltage to power its corona. Said not to create an inverse charge. Weighs 110 grams. Can be handheld or attached to adjustable mounting stand.

Shimadzu Scientific Instruments (SSI), www.ssi.shimadzu.com

The KISS-100 rework soldering machine is a contact-based system designed to selectively remove or install components such as connectors, through-hole components, and odd-form devices into boards, panels and other assemblies without disturbing nearby SMT components. Combines standard KISS solder pot and pump with a universal PCB holding and indexing nest and a vertical/tilt motion. Uses angular (tilt) extraction from the solder wave. This “tilt” motion reportedly permits solder to drain off component leads, preventing solder bridging and icicles. Control features are said to provide tools to set all process parameters including immersion depth, dwells in solder tilt extraction, travel distances and speeds, solder temperature and wave height. Nozzles are available to accommodate connectors up to 6" long. Handles PCB panels up to 18" x 24". Is Pb-free capable.
 

The compact Model 28.400 dual-wave solder system reportedly can handle large throughput while changing from one board width to another up to 15.75". Just under 10' long with a 53" preheat zone and average capacity of 250 boards per hour. Has an auto-adjust finger conveyor, with a built-in automatic, continuously re-circulating cleaning system. Comes standard with a 400 mm titanium solder pot. Includes spray fluxer, advanced touch-screen control, and worm-screw adjustment. Wave activation is said to be automatic when sensors detect arrival of PCBs. 
 
Manncorp, www.manncorp.com

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