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PF606-P128 lead-free LED die bonding solder is available for dispensing in syringes in lower viscosity; exhibits excellent slump characteristics, consistent dispense ability, and stable tackiness.

Shenmao America, www.shenmao.com

 

PF606-P116 lead-free LED die bonding solder reportedly offers long stencil printing life, high tackiness (slump resistance), and consistent printability with excellent wetting characteristics for LED die bonding.

Shenmao America, www.shenmao.com

 

Supreme 45HTQ-4 two-component epoxy features silicon carbide filler, for high-performance bonding, sealing, coating and casting. Serviceable from -100° to +450°F, is capable of withstanding rigorous thermal cycling. Tensile lap shear of 1,400-1,600 psi, compressive strength of 24,000-26,000 psi and and tensile strength of 8,000-9,000 psi. Retains strength at elevated temperatures. Is dimensionally stable, with low shrinkage upon curing. Dielectric constant at 60Hz of 4.6 and volume resistivity exceeding 1014 ohm-cm. Mix ratio of 100 to 30 by weight and thixotropic paste consistency. Pot life of more than 12 hr. at room temperature for a 100g batch. Requires oven curing at 250°-300°F with various cure schedules. Bonds to a variety of substrates including metals, composites, ceramics and most plastics. Comes in 0.5 pint to 5gal. kits Shelf life of 6 mo. at ambient temperatures.

Master Bond, masterbond.com

MAWA-300A Pulsed Micro TIG Welder now features a touch-start that controls and identifies weld location. Pulsation feature is said to significantly reduce porosity. For welding small coils and terminals, bus bars, and covered wires.

Amada Miyachi America, amadamiyachi.com

Femto 2 die bonder, for advanced packaging and bonding, has a placement accuracy of ± 0.5µm @ 3 Sigma.

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SA series automation feeders use SSF feeder technology to enable a range of interface and control capabilities, including ASCII communication protocol, lower profile form factor and optional SAFP robotic interface module for drop-in integration. Reportedly enable more integration flexibility and control options, particularly when smaller form factor or higher level of performance is required.

Hover-Davis, www.hoverdavis.com

 

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