Automated die attach tilt metrology is a new feature for shadow moiré or DFP systems (AXPs). Allows users to measure tilt angle of the bottom substrate to a mounted die/component/daughter board. Is embedded into existing Studio software platform to allow customers to automatically measure both warpage metrology and die attach tilt metrology on a variety of substrates. Measurements can be conducted pre-reflow at various temperature profiles during reflow and during reflow cooldown to examine effects die placement and temperature have on mating angle. Complete measurement of warpage and die attach tilt takes less than 2 sec. per measurement point along the temperature profile.

Akrometrix, www.akrometrix.com  

LTS300-Jedec molten solder lead tinning system consists of two dynamic nitrogen inerted solder pots, a dynamic flat wave fluxing station, forced convection preheating, aqueous wash and drying stations, plus a Jedec tray stacker, forming a complete component re-tinning work cell. Fully integrated vision system consists of top and bottom viewing cameras for accurate alignment of components prior to re-tinning. Vision system also performs post-tinning inspection to detect potential solder bridges before placing components back on tray. Fully configured system is capable of performing a molten solder component lead tinning process for gold removal and re-tinning of components for Class 2 and Class 3 applications in compliance with new J-STD-001F requirements.

ACE Production Technologies, ace-protech.com