Delomonopox VE 72768 dual-curing epoxy resin offers bonding accuracy and is resistant to substances like oil, transmission fluid, gasoline, methanol and printing ink. Designed with hardeners, it is used where bonded or encapsulated components are exposed to extreme temperatures and harsh chemicals. Permits defined glob top encapsulation in tight spaces on a printed circuit board. With light curing, glob top forms a skin and can “freeze” its shape; adhesive doesn’t flow away during heat-curing process. Curing is a two-stage process: Adhesive is light-fixed in up to 5 sec. to achieve a die shear strength of more than 1N on the FR4 PCB material; then it is briefly heat cured (for example, 30 min. at 150°C) to obtain its full strength of 50MPa on FR4. Is offered in two viscosities, one for bonding applications and another for encapsulation.  Operating temperature range is from -65°C to 180°C.

Delo, www.delo.de/en/

NeoHorizon screen printer features a totally modular design. Can be equipped with various clamping systems, conveyors, sensors, camera systems and the latest version of the DEK ProFlow ATx printhead system at any time. Core cycles time 7.5 sec. and accuracy rating of up to 15µm @2 Cmk. New, robust cover makes it possible to perform all operations and maintenance from front of machine. Back-to-back configuration provides dual-track solution, or can be split and installed on separate lines. 03 iX model comes with DEK HawkEye 750 camera system, semiautomatic stencil alignment and new IUSC understencil cleaning system and has a core cycle times of 8 sec. and accuracy rating of 20µm @2 Cmk, for high-mix environments. 01 iX model has a core cycle time of 7.5 sec. and machine accuracy rating of 15µm @ 2 Cmk, HawkEye 1700 camera system, fully automatic stencil loading and DEK Cyclone understencil cleaning system.

ASM, asm-smt-solutions.com

Siplace E series placement machine features a long-board option, new feeder modules, and an improved user interface for faster programming. Comes in two configurations: Flex and Speed. Both are equipped with high-precision linear drives, high-end vision systems and placement force sensors. JTF tray feeder and stick feeder now accommodates Jedec tray feeders and bar magazines. Long-board option handles PCBs up to 1200mm long and 4.5mm high, for LED applications and industrial products. New S-Programming software interface for creating component descriptions and placement programs.

ASM Assembly Systems, siplace.com/

SB6NX58-M500SI solder paste is designed for high-stress environments such as automotive. Contains 6% indium to balance and optimize thermal stress and deformation characteristics. Is said to offer improved solder joint strength over SnAgBiIn paste, especially with AuNi plated components. Anti-shock resistance is five times greater than SB6N, at 150C x 500 hr. aging. Shear strength after T/C at -40/+125C equals that of OSP substrates. 

Koki Co., www.ko-ki.co.jp