UV15X-6NM-2 one-component UV-curable urethane acrylate is for bonding, sealing, coating and encapsulation. Moderate viscosity, with an elongation exceeding 200%. Withstands rigorous thermal cycling and mechanical shocks. Serviceable over temperature range of -80° to +250°F. Good chemical resistance, especially to water, cleaning agents and oils. Refractive index of 1.50, is optically clear and has non-yellowing properties. Cures readily in 10 to 30 sec. when exposed to UV light. Is not oxygen inhibited. Cures can be obtained in sections approaching 0.25" thick. Bonds to glass, plastics including polycarbonates and acrylics, composites, metals and many types of rubbers. Can be purchased in 3 to 60cc syringe applicators.

Master Bond, masterbond.com

Sarcon PG80A is a low-compression, putty-like thermal interface material. The 13W/m°K gap filler pad conforms to most component shapes and uneven surfaces to transfer heat from its source to a nearby heat sink or spreader, while exhibiting a thermal resistance as low as 0.08°Cin²/W at 14 PSI. Is for applications that have delicate or wide-variation component heights and require material compression between 30% and 90%. Is available in four sheet thicknesses (0.5, 1.0, 1.5 and 2.0mm) up to a max. dimension of 300 x 200mm. Can be ordered in die-cut form. Is suited for environments with operating temperatures that range from -40° to +150°C and exhibits a UL94 flame retardant rating of V-0.

Fujipoly America, www.fujipoly.com

Malcom PCU-02V spiral viscometer conducts material testing and analysis by obtaining viscosity characteristics with a 0.2cc sample. Spiral sensor provides continuous measurement of non-Newtonian fluids with good repeatability. Measurement settings and data are available with software with or without a PC. Spiral Pump Sensor enables measurement of materials with high Thixotropy. Temperature control function allows for more accurate measurement and temperature characteristics analysis.

Malcom, www.malcom.co.jp/en/
Seika Machinery, www.seikausa.com

Tech Clip secures EMI shields to a printed circuit board. Can be attached to any circuit board using manual or high-speed automated placement equipment. Securely holds shield covers that range in thickness from 0.008” to 0.010”. Lightweight surface mount design is said to eliminate need for manual through-hole soldering and provide unencumbered access to board-level components for easy assembly, rework or maintenance. Comes in tape & reel packaging.

Leader Tech, leadertechinc.com