RSV series convection reflow soldering ovens include vacuum to reduce voids to fewer than 1%. Come in five or six heating zone versions, each with one vacuum zone and two cooling zones. Footprint is 5,070mm up to 6,229mm. Handle PCBs from 100 x 150mm up to 330 x 250mm. Large flux collection unit is said to reduce flux cleanings to a few times per year.

Eightech Tectron, www.eightech.com

Maxrel solder alloy comes in solder paste, preform and wire formats. Maintains shear strength after 1,000 thermal cycles under high CTE mismatch conditions. For LED chip-on-board (COB) assembly where high CTE mismatch can exist between the die stack and substrate, and creep fatigue properties of the solder material are important.

Alpha, alpha.alent.com/Markets/LED

Two Part Mix solder pastes come in two compartment bags that keep flux and solder powder separate from each other until mixed.  Have two-year shelf life without refrigeration.  Mix inside bag by squeezing flux toward powder, causing seal to release. Knead bag end-to-end for two to three minutes to fully mix the paste.

Chip Quik, www.chipquik.com

Jumbo Elephant surface cleaner removes electrically charged particles on electronic assemblies. Combines ionization, compressed air cleaning, extraction and filtration technologies. Ionization neutralizes surface charges. Integrated compressed air nozzle removes fine particles from wells or indentations. Particles are exhausted and filtered. Particle-free purified air can be fed back to the working area. Portable. Max. noise level is 49 dB.

Ult, www.ult.de