Micra rework system has been designed for mobile and small format printed circuit boards. Is for rework of smaller components, such as chip scale packages, package-on-package, and micro passives. Provides a 35mm alignment field of view, expanding its range of applications into more automotive, medical and military/aerospace products. Alignment capabilities include two-color LED illumination (red and white). Ergonomic zoom and focus control. Supports RF shields and connectors. Has capacity for boards up to 12" x 14" and convection heating. Auto Profile feature for higher volume production rework.

VJ Electronix, www.vjelectronix.com

TL XS 800 thermode-soldering system processes flex foils, cable wires, and ribbon cables. Features quick-change head. Path monitoring and temperature control enables solder joint inspection during soldering process and records operational data for quality control. Operates via a touch screen. Stand-by temperature, soldering temperature, and time until thermode reaches working temperature from stand-by can also be defined. Maximum working temperature of 450°C. Accuracy of ±0.02mm. Comes in table module or optional height-adjustable table system.

Eutect GmbH, www.eutect.de

Ultra-X semiautomatic ultrasonic stencil cleaner features a filtered closed-loop, recirculated and heated aqueous wash and a closed-loop DI water rinse with color-change resins.  Has a light-assisted optical inspection station. Comes with a high-pressure wand for maintenance cleanout and a built-in transfer pump. Uses a time-controlled 1000W, 40khz ultrasonic generator with power adjustment. Can clean, rinse, and dry stencils up to 29" x 29". Has a footprint of 50" x 34.5" x 52.5".

Austin American Technology, www.aat-corp.com/ultra-x

MPM Edison stencil printer features common software, controls and advanced technologies on a scalable platform. High speed, accuracy, and performance: is said to operate at twice the speed and 40% higher accuracy than current printers. All controls are in the front of the machine, permitting back to back lines. Accuracy is +/-8 microns @ 6 sigma; Cpk >= 2.0.  Cycle time is 15 sec. with wipe activated. On the fly fiducial capture. Footprint is slightly smaller than MPM Momentum printer.

Speedline Technologies, speedlinetech.com