FactoryLogix R3 incorporates an entirely redesigned Logistics module based on the same technology framework as NPI, Production and Analytics modules found in FactoryLogix, replacing the solution’s previous integration with the Diplan software suite. New and enhanced features include:
- materials receiving, processing and labeling;
- incoming quality control (IQC);
- stockroom management;
- material kitting and dispatch;
- material position tracking;
- moisture sensitive device (MSD) handling and bake management;
- production planning;
- resource scheduling;
- material reservation;
- shop floor material handling;
- workstation material setup validation;
- offline material setup;
- material traceability;
- material level monitoring;
- part replenishment and re-order.
Aegis Industrial Software, aiscorp.com
TriSpector1000 vision sensor is for 3D inspection. Is a standalone, configurable 3D vision sensor that reportedly inspects objects regardless of variations in object color, shape, or position. Intensity data enhance 3D navigation and allow sensor to check for object rotation or the presence of a label or printed pattern. Is suited for solving quality control applications in the consumer goods and packaging industry. Can be used for volume and thickness measurement and inspection of box integrity, including content verification, completeness and emptiness checks. Features IP 67 metal housing with plastic durable windows.
SICK, www.sickusa.com
Aquastorm60 inline cleaner features all-stainless steel construction and plumbing, mixed spray technologies for maximum process capability, and field-proven reliability. Footprint is less than 7'.
Speedline Technologies
Aquastorm60 inline cleaner features all-stainless steel construction and plumbing, mixed spray technologies for maximum process capability, and field-proven reliability. Footprint is less than 7'.
Speedline Technologies
Select-10 zero-halogen no-clean liquid flux withstands long dwell times and high preheat temperatures.
Automated die attach tilt metrology is a new feature for shadow moiré or DFP systems (AXPs). Allows users to measure tilt angle of the bottom substrate to a mounted die/component/daughter board. Is embedded into existing Studio software platform to allow customers to automatically measure both warpage metrology and die attach tilt metrology on a variety of substrates. Measurements can be conducted pre-reflow at various temperature profiles during reflow and during reflow cooldown to examine effects die placement and temperature have on mating angle. Complete measurement of warpage and die attach tilt takes less than 2 sec. per measurement point along the temperature profile.
Akrometrix, www.akrometrix.com
Press Releases
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Ryder Vietnam - Phase 2: Building resilience and meeting demand
- Scanfil and Etteplan deepen their strategic partnership into production testing