TestStation Multi-Site in-circuit test system features multiple test head support and concurrent test architecture to reportedly deliver two to four times productivity compared to conventional MDA/ICT systems. Inline automated handler is for high-speed, no-touch printed circuit board assembly test processing; supports panels up to 450 x 350mm, with up to 5,120 test points. Delivers mechanical board transport times of fewer than six sec.

UltraPin II 128HD channel card features 512 hybrid pins per card for high-complexity and high-density applications. Increases pin count to
15,360 pins. High-density channel card doubles system test point counts. Systems configured with 128HD can be configured to 15,360 test points.

LH ICT supports up to 4,096 test points. Multi-Site dual-site model supports two concurrently operating test heads in a footprint under 0.7 m².

Permit moving to automated no-touch manufacturing test. Handler has dual-site support in an 850mm wide footprint; is designed to replace two to four times as many automatic or manual MDA/ICT systems.

Teradyne, www.teradyne.com

JOT M10 Six Slider loads software on smartphones, either fully assembled products or at the board level. Box can be used as a standalone desktop unit or as part of a fully automated JOT M10 line, including integrated handlers and racks. Has a clear interface for customization and space for customized cabling and electronics. Is also applicable to dozens of other use cases besides software downloading.

JOT Automation, www.jotautomation.com

Dow Corning EA-7100 adhesive is based on silicone chemistry. Enables strong bonds to a variety of substrates. One-part, heat-cure adhesive cures rapidly and at lower temperatures from inside out. Forms strong bonds to metals, ceramics, glass, laminates, and plastics. Reportedly has up to 50% faster cure time than conventional heat-cure platinum catalyzed silicone adhesive systems; achieves full cure within 15 min. at 100°C. Designed for automotive electronics.

Dow Corning, https://www.dowcorning.com/

535-11M-7 UV cured epoxy was developed to pass the reliability requirements in disk drive, camera module, photonics and circuit assembly applications. Is an ultra-low stress, lower glass transition temp. version of 535-10M-1 UV cure adhesive. Can be used for lens bonding in camera modules, chip encapsulation in smart cards, and general bonding applications in photonics assembly. Reportedly cures rapidly when exposed to high-intensity UV light. Is a low outgassing, flexible, high-strength epoxy adhesive that does not contain antimony.

Engineered Material Systems, www.emsadhesives.com