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SBX02 alloy has a melting point below 140°C and can be used with peak reflow profiles between 155° and 190°C. Permits through-hole components requiring low peak temperature to be soldered by pin-in-paste low-temperature reflow, eliminating wave soldering. Features mechanical strength, the ability to absorb impact energy and improved drop shock resistance over SnBi0.4Ag alloy. Low voiding in BGA solder joints.

Alpha, alpha.alent.com/en/Solutions/Process/Low-Temperature-Alloys

Automated Normalization software addresses time required for PCB region-based tolerance tightening. Two-stage system is said to optimize printing, automatically normalize results and set tighter tolerances to monitor product drift. 5D measurement, combining 2D and 3D measurements, reportedly ensures proper zero referencing. Normalization extraction takes user-selected average area, height and volume from previous inspections when being set. If a process change needs to be made, such as stencil or print settings, normalization extraction can be readily reset and applied again.

MEK, http://www.mek-europe.com/

 

K7000 circular linear blade depanelizer singulates pre-scored PCBs with tight component spacing. Linear blade is 12" (304mm) long and has a 0.030" (0.762mm) thin symmetrical cutting edge designed for PCBs with closely spaced components. Circular blade is 3.8" (71mm) in diameter and has the same cutting edge profile as the linear blade. -- 0.030" (0.762mm) Blade is mounted on a shaft with centerline of the cutting blade passing directly through the middle of the support bearing. By placing the score-line on the linear blade and pulling the circular blade carriage across the upper score-line the panels can safely be singulated with minimal effort. Additional tooling available for safe board placement and handling during singulation.

FKN Systek, www.fknsystek.com

J-STD-001F certification soldering kit, for hand soldering certification to the newest standard, allows the trainer to administer training in tin-lead and lead-free RoHS compatible solders. Exceeds minimum requirements of J-STD-001F for soldering. It said to be an effective, cost-effective way to train and evaluate students and employees. Contains a variety of standard surface mount and through-hole components with traces to simulate real world situations. Comes individually boxed with all components bagged and labeled for easy identification. Conforms to J-STD-001E standard for soldering. Training center and bulk discounts available.

BEST Inc., www.soldertools.net

The 4800 wafer level bondtester was developed for testing wafers from 200mm up to 450mm. Paragon software provides flexibility for the creation and mapping of wafers, enabling setup of test patterns. Virtual images for each test pattern reportedly enable easy editing.

Nordson Dage, www.nordsondage.com

 

MP-520 SiP inspection system combines precision linear drive motor technology with 25MP CoaXPress camera, 3D confocal measurement system and Omni-vision 3D digital multi-frequency moiré technology. Is configured with eight phase color lighting and four 10MP side-view cameras. For measurement and inspection of solder ball/bumps, bond wire, chip bonds, discrete devices, heat sinks, underfill, printed circuit boards, and packages. Results are stored in a central database, enabling remote access SPC data through Intellisys total quality management system software.

Mirtec, www.mirtecusa.com

 

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