No. 988 is an electrically-heated, 650°F top-loading batch oven used to process electronic components. Workspace dimensions measure 12' x 1' D x 1' H. 15KW are installed in Incoloy-sheathed tubular heating elements to heat the unit, while a 600 cfm, 1/2-hp recirculating blower provides back-to-front horizontal airflow to the workload. Features 6" insulated walls, aluminized steel exterior, Type 304 stainless steel interior, a manual, counterweighted rear-hinged door, workspace floor reinforced for 100lb. loading, access door at each end of the oven, plus swivel casters with swivel locks and wheel brakes. Controls include a digital programming temperature controller, manual reset excess temperature controller with separate contactors and recirculating blower airflow safety switch.
The Grieve Corp., www.grievecorp.com
C2A-06-G1350-120 rectangular rosette gage and C2A-06-015LW-120 uniaxial linear gage are designed for precise, stable, and reliable stress analysis of printed circuit boards. Detect PCB surface strains at critical locations in consumer electronics. C2A-06-G1350-120 is a stacked rosette gage with a 5mm diameter matrix and 3m of three-conductor cable to eliminate lead wire soldering after bonding. Advanced Sensors strain gage technology reportedly makes smaller planar rosettes possible for use in surface mounting applications with restricted areas, as well as for intra-laminar strain measurement. C2A-06-015LW-120 is supplied with pre-attached cables; features active grid length of 0.015" and an overall matrix of 1.4 x 1.9mm. For installation on surface mount components.
Micro-Measurements, www.micro-measurements.com
VisionXP+ convection reflow soldering comes with vacuum option. Eliminates gas inclusions inline during convection process. Improves heat transmission and reduces emissions. Is said to cut energy use up to 20% and generate an average of 10 tons less CO2 per year. Vacuum model removes pores, gas inclusions and voids, and with a negative pressure of up to 2 mbar void rates of below 2% are possible. Pressure and speed can be regulated individually. Optional second pyrolysis installed under the inlet and outlet area makes effective residue management possible.
Rehm Thermal Systems, rehm-group.com
BasicLine and AdvancedLine AOI software now reportedly provide faster 360° inspection of components and solder joints. Enable higher fault detection. New optimization algorithms reportedly cut test procedure times up to 40% using multiple angled-view inspections from different directions. Angled-view module offers a large field of view with image quality at a viewing angle of 45°. Angled-view inspection with a rotation step size of 1° evaluates hidden solder joints. Software update available for installed systems.
Goepel electronic, www.goepel.com
Cion-LX Module/FXT48A boundary scan module for testing analog, digital and mixed signals reportedly extends boundary scan technology to non-scanable partitions. Has 48 single-ended and six differential channels with a voltage range between 0.9V and 3.6V. Dynamic test resources such as frequency counter, event detector, arbitrary waveform generator or digitizer are available for each channel. Both static and dynamic at-speed tests are possible. Is based on ASIC Cion-LX JTAG controllable mixed signal tester-on-chip.
Goepel electronic, www.goepel.com
E4990A impedance analyzer now has an enhanced measurement speed option. Low-frequency models now reportedly as fast as 120MHz E4990A model. Can use the option with the 10MHz (Opt. 010), 20MHz (Opt. 020), 30MHz (Opt. 030) or 50MHz (Opt. 050) low-frequency options. Reportedly increases measurement speed up to 10x. Analyzer has a frequency range of 20Hz to 10/20/30/50/120MHz and provides 0.045% basic accuracy, with a 40V built-in DC bias source. Equivalent circuit analysis function supports seven different multi-parameter models and enables simulation of equivalent component parameter values.
Keysight Technologies, www.keysight.com