StratoSphere Series plasma treatment equipment for wafer-level packaging and 3D packaging can now be configured in two, four or six chamber configurations for increased throughput and flexibility. Provide surface preparation and elimination of contamination for ashing, descum, bump, organic contamination removal, and wafer destress during semiconductor manufacturing operations, especially for applications such as 2.5D and 3D wafer-level fan-out. Handles semiconductor wafers up to 300mm (12") in diameter and supports automated handling and processing of round or square wafers. Processes thin wafers with or without a carrier, depending upon wafer thickness.

Nordson March, nordson.com

Vault Tooling Part Holder is available in a variety of standard sizes, pin lengths and densities; also can be configured for most applications and machines. Can be used in applications where the reduction of custom tooling, fixtures, molds or jigs is desired. Technology uses a high-density array of pins that automatically conform to the shape of any part. Once locked, it creates a “nest” to hold the part during the desired process. After completion, the tool is reset. Can be used on bench-tops, robots or integrated into machines or work cells.

Production Solutions, www.production-solutions.com

Martin MiniOven 05 BGA/CSP reballing and QFN prebumping system provides enhanced process capability with updated firmware and increased control and temperature stability. Hybrid heating technology heats electronic components similar to a standard reflow oven. A 4-button front display enables fast setup and management of multiple user-defined reballing and prebumping profiles. Profiles are generated using auto profile software and external thermocouple for real-time product temperature feedback. Easybeam Windows-based software enables profile management and backup. Supports inert atmospheres such as nitrogen and uses a gas distribution system.

Finetech, www.finetechusa.com

Gap Pad EMI 1.0 low stress thermal interface material unites thermal conductivity with EMI absorption capabilities. Offers heat and electromagnetic energy control. Has thermal conductivity of 1W/m-K and EMI absorption for frequencies above 1GHz. Thermal conductivity is enhanced by natural tack on one side. Has ability to conform to various topographies. Reduces in-field failures caused by solder joint stress and fractures. Comes in sheet and die-cut formats.

Henkel, www.henkel.com/electronics