LumenX programmer is capable of programming speeds up to 80 MB/sec. and download speeds of 25MB/sec. Offers management and security capabilities, and is said to eliminate security risks associated with duplication process. Software suite ensures data integrity from job creation through production. Includes comprehensive suite of traceability software applications along with fiber laser marking and 3D coplanarity component inspection. Comes on PSV7000 automated system and manual configurations. Supports eight sockets per programmer, with up to 14 in the PSV7000. Supports latest eMMC 4.41 to 5.1 devices

Data I/O, www.dataio.com/LumenX

EP3RR-80 one-component epoxy has a moderate viscosity, good flow properties and an unlimited working life at ambient temperatures. Additionally, this system can be stored at 40-50°F and does not require freezing. For bonding, sealing, potting and encapsulation applications, including flip chips. Is said to cure in 45 to 50 min. at 80°C (175°F), or in 25 to 30 min. at 250°F. Low exotherm while curing enables cure in thicker sections up to and beyond a 0.5" deep. Dimensionally stable compound forms high strength bonds to metals, composites, ceramics, glass and many plastics. Thermal conductivity of 5 to 6 BTU•in/(ft²•hr•°F) [0.72-0.87 W/(m•K)] at 75°F. Service operating temperature range is -100°F to +350°F. Comes in syringes and standard containers ranging from ½ pints to gallons.

Master Bond, masterbond.com/industries/underfill-encapsulants

Eagle 8800 3D AOI has color imaging and reportedly no need for a microscope. Color imaging can identify features on the surface of the printed circuit board, from solder paste prints to lifted leads. Features 100% 3D AOI, a low false call rate, plus SPC capability; can be paired with TROI series 3D SPI.

Pemtron Technology, www.pemtron.com

SPV screen printer features an innovative board handling system for leveraging various production flow schemas to increase production efficiency. Print cycle time of 10 s*2 including the entire printing process (PCB transfer, recognition and cleaning) per substrate. Simultaneous printing operation and mask cleaning. Dual-lane system simultaneously processes front- and back-side printing by utilizing a common screen mask that includes both images. Eliminates need for additional conveyors.

Panasonic Factory Solutions Co., http://www.panasonic.com