JT hot air station repairs all types of SMD, including large QFPs and PLCCs. Features two work modes, manual or program, to manage temperature and hot air flow. Can personalize more than 20 parameters, including activation mode of the tool: automatic, by button or by P-005 Pedal. Works with JT-TA heater and features USB-B connector for software updates. Comes with complete extractor desk and JT-SD stand; guarantees auto-stop function when tool is at rest.

JBC Tools, www.jbctools.com

Newhorizon pulsed heat reflow soldering system is for flex to ceramic, component to printed circuit board, flex to PCB, wire to PCB, and leadframe to PCB. Uses Uniflow 4 pulse heated reflow soldering power supply; hot-bar reflow soldering system provides integrated heat process control. Includes pneumatic bonding heads and 2-D or 3-D thermodes, X-Y thermode planarity adjustment, electronic temperature and system control, and digital bond force readout. Features active integrated cooling for heavy duty cycle operation. Is mounted on an adjustable frame; includes front-rear linear slide and manual or pneumatic rotary tables. Process parameters are embedded. Options include optical plug-and-play alignment modules and an interposer module for both Kapton and Sarcon tape in manual and automatic configurations.

Amada Miyachi America, www.amadamiyachi.com

Vigon RC 303 is a water-based cleaning agent developed for the removal of baked-on fluxes in reflow ovens and wave solder systems.  Removes re-condensed fluxes and emissions from condensation traps and heat exchangers. Does not have a flashpoint; can be directly applied to warm surfaces and safely operated in wave solder systems. Is available in a 1L spray bottle, as well as 5, 25 and 200L containers.

Zestron, www.zestron.com

Spectrum II now comes with optional Programmable Tilt + Rotate 5-Axis Fluid Dispenser enables the jet to dispense using five axes of automated control instead of three axes. Additional X and Y tilt modes enable dispensing from a vertical position and at varying tilt angles along all four sides of a device and up the side of a substrate or component, especially for 3D packages. Dispenses underfill, encapsulant, and coating fluids around tall substrate components on PCBs, flexible circuits, and in densely populated boards; provides fluid delivery to multiple sides of the latest-generation mobile device cases and sub-component camera modules by moving the nozzle tip closer to a target location such as a vertical wall; and dispenses into tight corners and narrow gaps in advanced packages. Determines height of die stack’s top layer and dispenses fluid along all four sides of the stack just below the top surface, so that sufficient fluid reaches the top of the stack without overflowing over the top. Fluidmove software provides automatic actuation of tilt and rotation functions during production. Dispenses up to ±30° with 1° resolution in either X or Y axis in tilt mode.

Nordson Asymtek, www.nordsonasymtek.com/tilt