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Unix FS flash soldering series has a speed upgrade with an integrated optical laser configuration; is reportedly two times faster than a typical laser. Can integrate pre- and post-soldering processes such as surface mount and through-hole devices. Depending on conditions, 100 points can be soldered in fewer than 30 sec. at <0.25 sec./point. Integrates soldering process for solder paste and wire; has a coaxial camera that follows soldering work scenes. Soon will feature automatic correction and error detection. Is possible to integrate pre- and post-soldering.

Japan Unix, www.japanunix.com

 

ACT100Lite automatic wet scrubber for metal masks used in solder printing is said to reduce costs and space requirements by limiting metal masks’ size to small. Uses a novel small-area scrubbing method. Scrubbing and drying occur inside scrubber, eliminating contact with solvent and exposure to airborne cleaning solution for operator safety. The simple configuration minimizes maintenance costs and the need to replace consumables.

OKI Communication Systems, http://www.oki.com

TC-3040 thermally conductive gel is a thermal interface material (TIM-1) developed with the help of IBM. Reportedly offers more reliable
thermal management, reduced stress and excellent under-die coverage for flip chip applications. Is said to deliver nearly two times the thermal performance of other industry standard TIMs, as well as high thermal conductivity targeting 4W/mK with reliability. Offers broader design options for high-performing, reliable ICs.

Dow Corning, www.dowcorning.com

 

Multi-ɸ variable laser spot diameter system optimizes laser exposure diameters to fit any component size or board patterns. Laser beam spot diameters are adjustable without moving. Beam spot diameters adjustable within 0.1-3.0mm. Diameter range determined by optical fibers and lens configuration. Variable spot diameters accommodate diverse component shapes and land patterns. New feeding mechanism feeds solder wire from any direction. Mixed-component assembly PCBs now can be processed with just one machine. Replacement laser heads are now available for existing laser soldering customers.

Japan Unix, www.japanunix.com/en/products/laser/multi-phi.php

Place-n-Bond underfilm is now offered with glue dots preapplied to the strip as an alternative for tacky pads. Testing now integrates into a standard SMT feeder. A thinner version of underfilm helps improve LGAs during shock, drop, and thermal cycling testing. Is a preformed thermoplastic packaged in tape and reel that is picked and placed with an existing SMT feeder. Bonds during reflow process and can be used in BGA reliability, flex-circuit-to-rigid-board bonding, encapsulating, and sealing. No dispensing, additional cure time or cold storage is required.

Alltemated, www.alltemated.com

 

Master Bond EP21TPFL-1AO is an electrically insulative two-part epoxy polysulfide system with a thermal conductivity of 9-10 BTU•in/ft2•hr•°F. Reportedly has good chemical resistance, particularly to fuels, oils, hydraulic fluids and related compounds. Is for bonding, sealing, coating and encapsulation applications in the electronic, aerospace, OEM and related industries. Has an elongation of 150-200%; can withstand thermal cycling and mechanical shock. Has low viscosity and a hardness of 70-90 Shore A. Color coding facilitates mixing. Part A is black and Part B is off-white. Working life is 90-120 min. at 75°F. Fully cures at ambient temperatures and should not be heated. Has good adhesion to metals, ceramics, composites, glass, and many rubbers and plastics. Is serviceable over range of -60°F to +250°F and has a six-month shelf life in original, unopened containers.

Master Bond, www.masterbond.com

 

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