M8 no-clean solder paste, for high-density electronics assemblies, has been developed in combination with T4 and finer mesh Pb-free alloy powders. Reportedly provides stable transfer efficiencies. Novel activator system provides durable wetting action accommodating a range of profiling processes and techniques. Reportedly eliminates HiP defects on BGAs and reduced voiding on QFN/BTC components. Based on NC258 platform.
AIM Solder, www.aimsolder.com
Updated XJTAG software reportedly increases flexibility for easier access to JTAG capabilities of boards and maximum test coverage. Dynamic chain profiling helps initialize boards with multiple JTAG chains, in which a device in one JTAG chain controls power supplies or reset lines for JTAG devices in other chains. During flash programming, can be set up to clock only JTAG data through the chain needed for programming operation. Can remove need to clock hundreds of bits of data per scan; speeds testing/programming. Increases capabilities of XJLink2 JTAG controller.
XJTAG, www.xjtag.com
Tuff Trac ESD Lo-CHAR technology is a dual-layer, PVC-based electrostatic discharging mat for use on floors and work surfaces where static discharge may be harmful. Mats are designed for use in monitored environments to perform at range of 106 to 108. Are manufactured with PVC that includes a blend of flame-retardant and low smoke chemistry. Meet ASTM standards for both smoke and flame resistance per NFPA Life Safety Code 101. In tests, reportedly barely sustained flame after 4 min. of continuous exposure and self-extinguished at 6 min.
The Biltrite Corp., http://biltrite.com/lochar/
White solder resist Elpemer SD 2491 SG-TSW-R6-B has excellent yellowing resistance after Pb-free reflow soldering and high thermal loads. Has thermal cycling test resistance of 500 cycles between -40 and 125°C. Has a reflectivity of ≈ 90% at 460nm and a yellowing resistance of Db ≈ 1,2. Is for LED applications in automotive electronics.
Lackwerke Peters, www.peters.de
Solvent-free thick film coatings Elpeguard Twin-Cure FP 115-0304 and FP 115-0306 were developed for LED curing at a wavelength of 395nm, followed by air humidity crosslinking in shadow areas. After UV curing, FP 115-0304 is tack-free within one hr. and inline-capable. Is best suited for protecting assembled printed circuit boards. FP 115-0306, once UV cured, takes longer to be tack-free; is good for all lighting electronics applications. Both reportedly have outstanding chemical, climatic and mechanical resistance.
Lackwerke Peters, www.peters.de
ULT 1500 and ULT 2500 are designed for removal and filtration of hazardous substances in dust, laser fume and welding smoke. Use conic filter cartridges. Dust deposits are collected in a removal container for low contamination disposal. Can be adapted to various process conditions. Can select extraction position. Feature optional swing check valve to protect pipelines. Can be used in limited spaces. Systems have front access. Rotary nozzle de-dusting reduces compressed air consumption. Filtered air can be fed back to working area.
Ultag, www.ult.de
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