RV-1 PWB automatic optical inspection and solder paste inspection machine inspects component mounting failures and solder printing failures. Compares PWB image data with data programmed in advance. Is equipped with 270mm large-diameter high-brightness white LED three-ring light and coaxial light. Twin linear motor, high-speed data transmission of CMOS camera and image processing library enables image shooting at 0.14 sec./frame. 3-D images synthesized from images shot with angle camera can be displayed for a final visual check. Software compares inspection images from multiple production lines.
Juki Americas, www.jukiamericas.com
BiAgX high-melt lead-free (Pb-free) solder paste is a drop-in replacement for standard high Pb-containing solder pastes. Is for small, low-voltage QFN packages used in portable electronics (smartphone/tablet), automotive electronics, and industrial applications. Is said to perform in at temperatures in excess of 150°C. Reportedly requires minimal process adjustments from standard high Pb-containing solder paste-based processes. Has passed MSL1 and thermal cycle testing at several power semiconductor customers. Is said to reflow, solder, wet and solidify like other solder pastes. Comes in dispense and printing forms. Fluxes are cleanable with standard cleaning chemistries and processes.
Indium, www.indium.com/BiAgX
EAC-7000 and ETF-700 systems are for hand assembly directly into a wave. EAC-7000 is a manual slide line system that offers a free rolling steel bearing system that permits printed circuit boards or pallets to glide from operator to operator. Is available in 15° and 0° rail sets. Includes ESD ground port, angled parts tray, overhead light and foot board. Has low-profile front fascia. Standard clip rail is included. When configured with ETF-700 (auto wave loader), operator can manually slide PCB or pallet to activate entrance sensor.
Promation, www.Pro-mation-Inc.com
585-1 nonconductive paste provides reliability to gold stud bump interconnects used in flip-chip packaging. Has high fracture toughness and adhesion. Is ionically clean and cures in seconds during thermal compression bonding at 200°C.
Engineered Material Systems, www.emsadhesives.com
PanelScan traceability and inspection system captures 1D and 2D barcode data from multi-array PCBs at the front-end or mid-stream on an SMT line. Is said to read barcodes on entire length and width of any PCB array. Intuitive user interface for quick training. Replaces manual scanning. Does not require line shutdowns to reposition, reconfigure, and test barcode readers. Comes in standard and wide configurations. Includes up to two GigE line scan cameras and lenses, up to two custom LED lights, software, trigger, and cables. Integrates into existing manufacturing execution system (MES) software.
Microscan, www.microscan.com
RP-1 solder paste printer has a special mechanism to align the bare PWB with a screen mask; drives three alignment modules attached on the outer circumference of the mask stage to adjust the position in X, Y and θ directions simultaneously. This permits repetitive printing accuracy of circumference fine adjustment to improve up to ±10μm, and duration including correction and movement time reduced to six sec. Optional automatic solder dispenser and cleaning functions available.
Juki, www.jukiamericas.com
Press Releases
- OKI Develops Ultracompact Photonic Integrated Circuit Chip Using Silicon Photonics Technology to Realize Various Optical Sensors
- AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum
- Occam Strengthens Leadership Team with Addition of PCB Expert Dana Korf
- ITW EAE Expands Partnership with Etek Europe to Represent Despatch Products in the UK and Ireland.