LEN66AL optoelectric die attachment adhesive is UV curable and said to be fast bonding. Reportedly provides bubble-free optical coverage and moisture resistance. Bonding flexibility dissipates thermal stress from different CTE substrates. Meets MIL-I46058C and IPC-CC-830 and RoHS compliant. Is specifically for chip attachment.

Yincae Advanced Materials, www.yincae.com

SMT256 Solder Joint Encapsulant replaces traditional underfill on printed circuit boards. Is said to create a bond stronger than using existing soldering/underfilling methods. Is for board- and package-level high-speed and high-durability applications.

Yincae Advanced Materials, www.yincae.com

LCR Control Module is a closed-loop system that reportedly eliminates the risk of placing wrong passive components on printed circuit boards.  In combination with the Offline Job Setup or Line Setup Control module, the software is integrated with an electrical LCR meter. Verifies the measured values – inductance, capacitance, and resistance – are within the tolerances specified for the component part number. Verification can be done at any time prior to mounting the reel on the placement machine.

Cogiscan Inc., www.cogiscan.com

Cool-Pad CPR7154 thermal interface material dispenses like a thermal pad, but is said to show characteristics of a grease or gel when device temperatures increase to above 45°C. Is optimized to accommodate large areas with different heights and gaps of less than 3 mils along its interfacing area. Is filled with a modified oxide mixture and is electrically insulating at normal voltage. It is designed to have high compressibility. "Melt flows" at 45°C to fill trapped air along interface between device and heat-sink or heat-spreader. Is semi-tacky on both sides for thermal transfer performance. Thermal conductivity and Tg characteristics are said to impose minimum thermal stress on bonded parts during thermal cycling or shock testing. Is not designed for bonding.  Will fill in uneven height differentials and warps between the mating surfaces. For outdoor LED luminaire applications, CPU and GPU in Xbox360, Play Station, and other game consoles, and CPU modules and graphic card interfaces in laptops and desktops.

AI Technology, www.aitechnology.com