535-10M-49 UV cured epoxy adhesive was formulated for disk drive, camera module, optoelectronic and circuit assembly applications. Contains a secondary thermal cure initiator that cures as low as 110°C for shadowed areas. Is ultra-low stress, low shrinkage, and ionically clean, with low glass transition temperature. Designed to eliminate warpage of components in disk drive assemblies, lens bonding in camera modules, chip encapsulation in smart cards and general bonding applications in photonics assembly.  Cures rapidly when exposed to high-intensity UV light.

Engineered Material Systems, www.emsadhesives.com

Vision Inspection Cell is a test solution for vision inspection of display and camera functionalities of wireless devices. Is fully integrated and based on parallel testing option and adjustable camera quantity. Can be configured to various device sizes by changing cameras and lenses. Can be used to configure benchmark and deploy a system that addresses vision applications from pattern matching to code reading and presence detection.

JOT Automation, www.jotautomation.com

Trident ZDO fully automatic cleaner/defluxer is completely zero discharge, and automatically washes, rinses, verifies cleanliness, and fully dries assemblies within a single compact machine. Requires no separate water recycling systems as both the wash-solution recycling system and the rinse-water recycler are built into the machine. Contains effective shadow mitigation technology for cleaning fine-pitch, low-profile components. Built-in cleanliness verification capability ensures assemblies are cleaned to pre-selected cleanliness levels. Wireless barcode scanner permits all assemblies being cleaned to have their serial numbers scanned and entered into the machine's SQL database. All process data, including set and actual cleanliness results are stored and are searchable in a multi-query format for the most powerful SPC available on any cleaning system.

Aqueous Technologies, www.aqueoustech.com

FX-940 inline AOI features 9-MP color camera imaging. Includes top-down viewing camera, four side-viewing cameras and 3D inspection. Inspects solder joints and component assembly for solder defects, lead defects/lifted leads, component presence and position, correct part/polarity, through-hole parts, and coplanarity of chips, BGAs and other height-sensitive devices. Configurable for all line positions. Can be used for paste, pre / post-reflow and final assembly inspection. Intuitive offline programming. Real-time SPC monitoring. Uses a standard package library to simplify training and ensure program portability across manufacturing lines.

Nordson YesTech, www.nordsonyestech.com