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Coolspan thermally and electrically conductive adhesive film is thermosetting, epoxy-based, and silver-filled. Is used to bond circuit boards to heavy metal backplanes, heat sink coins and RF module housings. Can be used as an alternative to fusion bonding, sweat soldering, mechanical, or press fit metal attachment. Is supplied in sheet form on a PET; is reportedly easy to handle when converting into preforms and when peeling from the carrier. Withstands Pb-free solder processing. Offers chemical resistance and high-temperature performance.

Rogers Corp., www.rogerscorp.com

Large/heavy PCB and backplane handling equipment features 10mm wide positive track ESD belts (capped to 3mm edge contact). Capable of transporting up to 40 lb. PCB and backplane panels ranging up to 30" in width and 36" in length. Options include vertical buffering, turns, accumulation and more.

Promation, www.Pro-mation-Inc.com

DF2400 C-SAM acoustic microscope reportedly has 2x to 7x faster throughput than previous systems. Is automated and convertible to perform laboratory analysis. Can inspect ICs and flip chips in JEDEC-style trays or in metal carriers; inspects lead frame strips, IGBT power modules and other components. Throughput is reportedly doubled by incorporating two transducers and two simultaneous scanning stages. Two inertially balanced linear motor scanners reduce vibration and achieve scanning of ±0.5µm. Perform reflection-mode and Thru-Scan mode imaging. Uses non-immersion technology to minimize water exposure; can continuously control quality of water. Software makes acoustic images of up to 100 selected depths within a sample during a single scan. SECS-II/GEM E30 and SMEMA compatible.

Sonoscan, www.sonoscan.com

 

PCBGRIP electronics assembly system holds printed circuit boards in place to aid in the speed of assembly. Flexible, modular design is said to simplify a variety of electronics assembly tasks, including holding through-hole components (even upside down) in place during soldering; holding SMT stencils during paste application, and holding components in place. Permits PCB to be rotated, tilted, swung around, or raised/lowered.

PCBGrip, www.pcbgrip.org

J-STD-001 inspection kit helps MITs and Certified IPC Trainers administer physical inspection requirements of Module 5 of the IPC-J-STD-001 training program. The kit includes a DVD; instructional video; board layout form; student terminal inspection worksheets; student printed circuit assembly inspection worksheet; instructor answer keys; encapsulated inspection samples; six printed PCA samples, and eight soldered terminal samples.

STI Electronics, www.stielectronicsinc.com

535-10M-45 UV cured epoxy adhesive is formulated for disk drive, camera module, optoelectronic and circuit assembly applications. Contains a secondary thermal cure initiator that cures as low as 90°C for shadowed areas. Is an ultra-low stress, low shrinkage, ionically clean, low glass transition temperature UV cure adhesive. Is designed to eliminate warpage of components in disk drive assemblies, lens bonding in camera modules, chip encapsulation in smart cards, general bonding applications in photonics assembly. Cures rapidly when exposed to high-intensity UV light. Low outgassing. Contain no antimony.

Engineered Material Systems, www.emsadhesives.com

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