K2 thermal profiler has plug-and-play hardware and a graphical user interface said to make profiling both quick and easy. Enables each thermocouple to use its own unique process window, while optimization software automatically suggests best oven setup to process the entire PCB and components in spec. Reportedly permits oven setup in a few seconds. Profile data measured can be viewed on a PC and authorized Android and Apple mobile devices. Mobile Profile Viewer App is WiFi and Bluetooth compatible. Features fail-safe software that reduces the opportunity for error, allowing pre-set quality parameters.

KIC, www.kicthermal.com

Fine-L-Kote high viscosity AR acrylic conformal coating reportedly widens the process window and flexibility. Can use as-is for dipping or thin down for spray systems. Is for selective spray systems both atomized and airless. Designed with high solids content. For high-speed coating of automotive electronics, consumer electronics, etc.

Techspray, www.techspray.com

NC273LT solder paste for Bi-containing alloys is designed for low-temperature applications. Activator system said to improve wetting performance of bismuth alloys to RoHS-compliant plating and surface finishes. Reportedly offers excellent transfer efficiencies, long stencil life and minimizes solder balling.

AIM, aimsolder.com

NC520 no-clean, halogen-free solder paste is for high-density electronics assemblies. Is said to offer excellent wetting, improved printing and reduce voiding. Results in bright, smooth and shiny solder joints. Consistent transfer efficiencies reduce head-in-pillow defects even when component/substrate coplanarity is not optimal.

AIM, aimsolder.com