ESM-200 multifunctional magazine handling system is configured for front-of-line, end-of-line or middle-of-line. Works as a line loader, line unloader or magazine rack buffer (LIFO or FIFO), and can handle post-AOI sorting or act as a pass-through conveyor. Automatic width adjustment option facilitates product changeover. Comes in four sizes. Intuitive touch panel for configuration as needed. Roller wheels permit easy movement throughout the factory without use of fork lift or hand truck.

Promation, www.Pro-mation-Inc.com

Fine-L-Kote High Viscosity AR acrylic conformal coating is said to have a high viscosity for use as-is for dipping, or to thin for spray systems. Protects against moisture, thermal cycling, dust, debris, and other environmental contamination. Certified to IPC-CC-830B, MIL-I-46058C, and UL94 V-0, qualifying the final cured coat as nonflammable.

Techspray, a division of Illinois Tool Works, www.techspray.com

XM8000 wafer x-ray metrology platform reveals optically hidden and visible features of TSVs, 2.5D and 3D IC packages, MEMS and wafer bumps. Provides nondestructive, inline wafer measurement of voiding and fill levels, overlay and critical dimensions.

Nordson DAGE, www.nordsondage.com

Spherolyte RDL / Pillar 2 process for high-speed plating of copper pillars and redistribution layers (RDLs) is a sulfuric acid-based three additive copper electrolyte system. Nonuniformity value – within wafer, die or/and profile – of the deposited copper structures, even over a range of applied current densities, is up to 17.5 ASD  (3.9 µm/min). Process control is analyzable through an online system for all additives. Is for flip-chip applications for various sizes of copper pillars (including µ-Pillars), especially for handhelds such as tablets or smartphones.

Atotech, atotech.com