XJTAG version 3.2 release comes with a "no netlist" feature for creating projects within XJDeveloper for boards without netlists, using just BDSL files for JTAG devices. Connections between these devices are derived from a working board and automatically added to the project. Allows adding of non-JTAG devices to these projects by specifying how they are connected to the JTAG devices on the board. Such devices can then be tested using XJEase Library files to improve test coverage and save time of physical test. Now contains graphical debugger, for use when developing XJEase code. Standard debugger features such as breakpoints and a watch window for monitoring and changing XJEase variables will help improve efficiency when developing new tests.

XJTAG, www.xjtag.com

RX-7 compact, high-speed chipshooter is capable of placing 49,000 cph (per IPC-9850) and is 988mm wide. Features two compact rotary heads capable of 16 nozzles per head. Reported placement accuracy is ±40µm (Cpk > 1). Each Super Rotary Head has two cameras on board, one recognition camera to take images of each component from the rear surface and a pick inspection camera to take images of component and nozzle point from the side surface. Supports up to 76 8mm parts for placement. Self-diagnostic function conducted during startup and production is said to improve production by giving alerts when there is a problem with the machine. GUI can jump to any objective function quickly.

Juki Automation Systems, www.jukiamericas.com

RNV Series vacuum reflow oven is said to reduce solder joint voids when soldering larger PCBs and area-array packages through a combination of hot air reflow, nitrogen purge and heat circulation vacuum.  Features include ultra-low power consumption, an efficient and large capacity flux recovery system, soldering capability of heat sinks with metal substrates, and fast tact time. Uses reflow in combination with hydrogen/formic acid for a no-flux wash process, lowered influences on insulation resistance and ion migration, and void-free soldering. Comes in batch model, for prototype and lab applications, and inline systems for volume and higher temperature applications.

Eightech, www.eightech.com

Seika Machinery, www.seikausa.com

Hybrid pick-and-place machine is capable of 7µm placement accuracy. Placement head carries one component at a time. Provides low-force closed-loop placement. Reportedly has placement defect rate < 1 dpm. Places up to 121,000 passives per hr. and up to 27,000 flip chips per hr. Controllable placement Z-axis can adapt placement height search algorithms for different heights, optimizing placement force for 2.5D mounting, package on package or embedded passive and active devices.

Assembléon, www.assembleon.com