MicroLine 2000 laser system, for separation of bare and assembled rigid and flexible PCB materials, come with different laser powers. Feature faster fiducial registration and optimized dynamics. Software facilitates production setup. MicroLine 2820 SI is inline-capable and can be integrated directly into SMEMA-compliant production lines.
LPKF, www.lpkf.com
TAGS: LPKF, separation, scoring PCB, printed circuit board
Have you registered for PCB West, the Silicon Valley's largest printed circuit board trade show? Sept. 24-26, at the Santa Clara Convention Center. www.pcbwest.com
MicroLine 2000 laser system, for separation of bare and assembled rigid and flexible PCB materials, come with different laser powers. Feature faster fiducial registration and optimized dynamics. Software facilitates production setup. MicroLine 2820 SI is inline-capable and can be integrated directly into SMEMA-compliant production lines.
LPKF, www.lpkf.com
TAGS: LPKF, separation, scoring PCB, printed circuit board
Have you registered for PCB West, the Silicon Valley's largest printed circuit board trade show? Sept. 24-26, at the Santa Clara Convention Center. www.pcbwest.com
KISS-102 selective soldering machine now comes with a board size and soldering area of 16” x 16” (406 x 406mm) with no increase in machine footprint. Handles a range of flux types with either an atomizing flux applicator for speed or precision drop-jet applicator for no-clean processing. Optional “Super Quick” z-axis motion and closed-loop positioning feedback with linear encoders, dual solder nozzle pump assembly, and dual LCD monitors.
ACE Production Technologies, www.ace-protech.com
Fineplacer pico ma is for bonding anisotropic conductive film (ACF). Achieves applied bonding forces of up to 700 N, for coherent, durable bonds between the chip and ACF. Features a new multi-chip transfer station, which permits up to four components to be placed simultaneously and bonded with defined distances. Precision z-hub positioning table achieves 5-micron placement accuracy. Places component sizes from 0.125 x 0.125mm to 40 x 40mm and the shifting optics enable alignment of long chip edges. Supports wafer or substrate sizes up to 8". Suited for high-mix, low-volume applications.
FineTech, www.finetechusa.com
TAGS: FineTech, ACF, anisotropic conductive film, component bonding
Loctite Multicore HF 212 halogen-free, Pb-free solder paste is under the limit of detection for chlorine and bromine. Reportedly has consistent print performance and minimal hot slump, even at temperatures that exceed 86°F and relative humidity as high as 80%. Exhibits low voiding in CSP via-in-pad joints, good coalescence, and solderability over a range of surface finishes, including NiAu, immersion Sn, CuNiZn, immersion Ag and OSP copper. For use on components with pitches of 0.3mm and greater; is ideal for larger boards used in industrial, networking and lighting applications.
Henkel, www.henkel.com/electronics
Loctite Multicore HF 212 halogen-free, Pb-free solder paste is under the limit of detection for chlorine and bromine. Reportedly has consistent print performance and minimal hot slump, even at temperatures that exceed 86°F and relative humidity as high as 80%. Exhibits low voiding in CSP via-in-pad joints, good coalescence, and solderability over a range of surface finishes, including NiAu, immersion Sn, CuNiZn, immersion Ag and OSP copper. For use on components with pitches of 0.3mm and greater; is ideal for larger boards used in industrial, networking and lighting applications.
Henkel, www.henkel.com/electronics
Press Releases
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- AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum
- Occam Strengthens Leadership Team with Addition of PCB Expert Dana Korf
- ITW EAE Expands Partnership with Etek Europe to Represent Despatch Products in the UK and Ireland.