Pico xMod dispensing valve uses piezoelectric actuation technology for continuous operation at speeds up to 500 cycles/sec. Can produce deposits as small as 2nL. Reportedly non-contact jet valve makes it possible to apply fluid in hard-to-access areas or onto uneven or delicate substrates for applications in electronics, automotive, life sciences, solar, and other industrial dispensing applications. The Piezo Actuator, the Valve Seat, the Fluid Body, the Cartridge ball/stem assembly, and Heater Set are interchangeable and assembled for each application; can be disassembled for cleaning, repair, or maintenance.

Nordson EFD, www.nordsonefd.com 

Sarcon GR45A-00 is a low modulus thermal interface material with a low thermal resistance. Fills air gaps between components, board protrusions and recessed areas. Reportedly exhibits very low pressure. Provides thermal conductivity of 6.0 W/m°K per ASTM D2326 (4.5 W/m°K per ISO/CD 22007-2 Hot disk) and a thermal resistance as low as 1.33°C cm²/W. Is available in pre-cut sheets up to a max. size of 200mm x 300mm. Can be die cut to application specifications. Material thicknesses from 0.5mm to 5.0mm can be specified in 0.5mm increments.

Fujipoly America Corp., www.fujipoly.com

ViproInline AOI system for THT assemblies can be integrated into an automated production line after the wave or selective soldering process for the detection of soldering and placement faults. Features camera lighting unit designed for bottom-side inspection of through-hole assemblies. Detects soldering and placement faults such as bridges, open solder joints, poor meniscus or missing pins, solder balls and washed off neighboring SMD components. Orthogonal sensor head allows analysis with its vertical viewing direction. Images are captured with a 5mp RGB area scan camera. Multi-color LED lighting consists of centrically focused and diffused lighting from the side. Can be equipped with a 10mp camera or with several bottom-side cameras. Can be provided with an additional axis and camera unit for the detection of hole fill at the PCB topside, as well as simultaneous solder joint inspection of through-hole and glued SMD components. Can be integrated into the PowerSelective system.

Seho Systems, www.seho.de

Automatic Paste Dispenser II works in parallel along other printer functions to minimize time loss and deliver consistent paste volumes to the stencil for process control. Is said to be easy-of-use and reliable, for complete control of dispensing profile by optimizing speed, pressure, position and frequency to ensure paste deposition when and where required. Helps eliminate lost areas of material, which can contribute to yield losses, particularly with finer-pitched components. Deposits paste simultaneously during stencil cleaning so that the equipment is being fully utilized to streamline production time and increase throughput. Cartridge changeover said to be less than two minutes. Offers paste level detection, compatibility with industry-standard material syringes and fully programmable dispense stroke (length) and position (x, y).

DEK, www.dek.com/paste-dispenser