B-724, B-727, B-728 and B-729 polyimide labels withstand harsh condition wash systems and chemicals. Are engineered to stay adhered to boards during inline and batch washes. Reportedly offer temp. performance up to 500⁰F and excellent resistance to harsh fluxing and wave solder environments. Are RoHS and Reach compliant, UL969 recognized and available in custom sizes.

Brady Corp., www.bradycorp.com

PS300 2HY hybrid batch stencil cleaner is suitable for stencils, PCBs, misprints and solder frames. Is an automatic single-chamber system; features 3-4 step PowerSpray cleaning. Is part of compact C-Class series. Includes two tanks and three circuits. Is PLC-controlled. The three-stage program selector for stencil, misprints, and carriers is pre-configured. Up to 99 programs can be written and saved for later recall. Has safety interlocks, master lock out switch and pressure control switches monitoring tank A and B values. Features ClosedLoop processing.

Kolb Cleaning Technology, www.kolb-ct.com/en/

Cognex Industrial Camera (CIC) series are GigE Vision digital industrial cameras designed for integration with VisionPro and CVL vision software. First four models are 29mm x 29mm, monochrome, area scan cameras. VisionPro provides access to a library of computer vision tools, from geometric object location and inspection to identification and measurement algorithms.

Cognex, www.cognex.com/cic
 

535-18M-57 UV cured epoxy adhesive is formulated for microelectronic assembly applications. Is an ultra-low stress, low shrinkage, ionically clean, low glass transition temperature UV cure adhesive. Is designed to eliminate warpage of components in disk drive assemblies, lens bonding in camera modules, chip encapsulation in smart cards and general bonding applications in photonics assembly. Reportedly cures rapidly when exposed to high-intensity UV light. Does not contain antimony.

Engineered Material Systems, www.emsadhesives.com