Siplace Di-Series placement machines include digital vision systems, single and dual conveyors and multi-language station software. Available with one, two and four gantries. Siplace D1i, Siplace D2i and Siplace D4i place components down to 01005s. Include S-feeders. Component cameras have high-resolution; changeover tables are newly developed. Can accommodate three flexible head types: the 12-nozzle collect and place head, the 6-nozzle collect and place head, and the TwinHead.

ASM Assembly Systems, www.siplace.com 

Tin-bismuth-silver solder paste for SMT assembly has silver content of >1% for improved mechanical reliability and thermal cycling. Melting point is around 139°C. Offers good soldering yield for temperature-sensitive components, shorter reflow cycle times and reduces energy.

Inventec, www.inventec.dehon.com

Scorpion high-speed jetter has piezo jetting valves that enable jetting with speeds of up to 800Hz. Fluid box is less than 150nl. No tubing to connect fluid to jet valve. Can be equipped with up to four valves or pumps, including jet valves, Archimedian screw valves, time pressure valves and slider valves. eDIS software offers context-sensitive help; CAD import is supported. Includes library of best known parameters for common fluids.

Essemtec, www.essemtec.com

MPM Momentum Compact printer is 30% smaller overall than the standard Momentum. Equipped with the new EnclosedFlow print head option, it reportedly prints fine features such as 01005s and 0.3mm pitch CSPs with up to 50% greater volume and 25% lower deviation than squeegee blades, and paste volumes over 50% for 150µm apertures with a 0.35 area ratio. Wet print accuracy reportedly 18µm @ 6ó, Cpk>2. Configured standalone or inline. Other options include board snugging, auto paste dispenser, paste height monitor, 2D contrast and enhanced inspection, board support, and print capability verification.

Speedline Technologies, www.speedlinetech.com