Many Separo solder recovery system quickly and easily reclaims solder. Reportedly turns a shift's worth of wave solder dross to usable solder ingots in under an hour.  Works with lead-free or SnPb alloys and is capable of treating 4 to 5 kg (9 to 11 lb.) of hot or room-temperature dross per cycle. Heavier solder alloy settles at the bottom of a heated crucible while lighter dross oxides rise to top and are captured in a custom filter. After 30 to 40 min. molten solder is transferred to the five ingot molds below the crucible. No chemical additives required. Reclaimed alloy is 100% pure and usable.

MGR Electro, mgrelectro.com/en/prodotti/separo-2

Manncorp, manncorp.com/solder-recovery

Fusion platform incorporates high speed DC servo drive and reduced line length. Standard cell handles PCBs up to 508 x 952mm (fluxer/preheat/solder), or for high speed applications can be configured with fluxer/preheat and up to 3 solder modules with 5 heater options. Solder cells can be configured with custom dip, multi-dip, jet-wave and single point AP down to 1.5mm. Features auto pot changer for noncontact changeover.

Pillarhouse, www.pillarhouse.biz

XACT 3 inline screen and stencil printers feature a 508 x 508mm (20 x 20”) print format, and 12 sec.+ print cycle times. Come with adjustable stencil guide rails and accept stencils up to 29 x 29” without adapters. EVA vision system ensures ±15µm @6 Sigma alignment repeatability and facilitates 2D print inspection. Pneumatically driven closed-loop print heads ensure constant print pressure throughout the print stroke. Cleaning system benefits from side channel fan upgrade with higher vacuum flow. Features servo motors and upgraded L-shaped belts to improve transport of thin substrates. Options include 2D print inspection, vacuum tooling set-up, heavy duty transport and SPC data interface. User-friendly Wizard interface eases setup.

ASYS Group, www.asys-group.com

CondensoXS vapor phase reflow system reduces floor space by 25%. Uses injection principle and controls temperature and pressure (vacuum) for precise, diverse reflow profiling. Solders heavy units quickly and reliably. Horizontal transport of the assembled board prevents components from slipping, reducing reject rates rework requirements. Boards load at the front, underneath the cooling system.

Rehm Thermal Systems, www.rehm-group.com