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TC-2030 and TC-2035 thermally conductive adhesives were developed to enable design of more compact, reliable and higher performing automotive electronics assemblies. Are two-part, heat-cured silicone technologies. TC-2030 has a thermal conductivity of 2.7 W/mK. Reportedly provides improvement in elongation performance. Has bond line thickness of 130µm. TC-2035 helps manage heat in automotive applications, including power electronics. Has 3.3 W/mK thermal conductivity and BLT as low as 50µm. Bonds to thermal substrates, including direct bonding copper, high-density interconnect, low-temperature co-fired ceramic and printed circuit boards. Sustains performance at temperatures reaching 200°C.

Dow Corning, www.dowcorning.com
 

TC-2030 and TC-2035 thermally conductive adhesives were developed to enable design of more compact, reliable and higher performing automotive electronics assemblies. Are two-part, heat-cured silicone technologies. TC-2030 has a thermal conductivity of 2.7 W/mK. Reportedly provides improvement in elongation performance. Has bond line thickness of 130µm. TC-2035 helps manage heat in automotive applications, including power electronics. Has 3.3 W/mK thermal conductivity and BLT as low as 50µm. Bonds to thermal substrates, including direct bonding copper, high-density interconnect, low-temperature co-fired ceramic and printed circuit boards. Sustains performance at temperatures reaching 200°C.

Dow Corning, www.dowcorning.com
 

LED Mounter JX-300LED has a larger printed circuit board size capacity and improved placement speed. Is capable for production of max. 1200mm PCBs. As an option, it can produce max. 1500mm PCBs.  Can place light diffuser lens by using laser sensor to identify boss on the lens to determine the correct direction. Mid-size LED components can be placed in 19,300 CPH, with 12mm tape feeder, 6 nozzle alternate placement by 3 nozzle simultaneous pick (two times). Is capable of PCB size 610 x 360mm by one time clamp, 1200 x 360mm by two times clamp, and 1500 x 360mm by three times clamp.

Juki, www.juki.co.jp

LED Mounter JX-300LED has a larger printed circuit board size capacity and improved placement speed. Is capable for production of max. 1200mm PCBs. As an option, it can produce max. 1500mm PCBs.  Can place light diffuser lens by using laser sensor to identify boss on the lens to determine the correct direction. Mid-size LED components can be placed in 19,300 CPH, with 12mm tape feeder, 6 nozzle alternate placement by 3 nozzle simultaneous pick (two times). Is capable of PCB size 610 x 360mm by one time clamp, 1200 x 360mm by two times clamp, and 1500 x 360mm by three times clamp.

Juki, www.juki.co.jp

Mini Wave Selective process measurement instrument now comes with flux measurement system to monitor flux position accuracy during daily benchmarking of machine performance. Includes precision sensors and complimentary measurement circuits to permit flux to be easily assessed. Detects flux presence and position verification when sprayed upon an assembly. Sensor heads made of titanium or high-temperature thermoplastics. Provides a "one pass" platform for measuring X and Y speed, solder temperature, preheat profiles, contact time and flux positioning verification.

SolderStar, www.solderstar.com


 

 

Mini Wave Selective process measurement instrument now comes with flux measurement system to monitor flux position accuracy during daily benchmarking of machine performance. Includes precision sensors and complimentary measurement circuits to permit flux to be easily assessed. Detects flux presence and position verification when sprayed upon an assembly. Sensor heads made of titanium or high-temperature thermoplastics. Provides a "one pass" platform for measuring X and Y speed, solder temperature, preheat profiles, contact time and flux positioning verification.

SolderStar, www.solderstar.com


 

 

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