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C.FL series coaxial connector serves 5G device market.

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Vishay Techno CDMM high-voltage chip divider is now offered in a ribbed molded package with compliant surface-mount leads.

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IHVR-4025JZ-3Z vertical-mount inductor comes in 10.25mm x 6.4mm x 10mm 4025 case size.

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New software on 3Xi-M110 inline 3D-AXI system for printed circuit board inspection reduces cycle time up to 50%.

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VT-S10 series 3D AOI uses multi-direction, multi-color imaging, MPS 3D hardware and AI to reduce false calls, improve first-pass yields and optimize defect detection.

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Meister D+ True3D inspection system is for chiplets and system-in-package devices, including die and surface mount components.

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