Vishay Techno CDMM high-voltage chip divider is now offered in a ribbed molded package with compliant surface-mount leads.
IHVR-4025JZ-3Z vertical-mount inductor comes in 10.25mm x 6.4mm x 10mm 4025 case size.
New software on 3Xi-M110 inline 3D-AXI system for printed circuit board inspection reduces cycle time up to 50%.
VT-S10 series 3D AOI uses multi-direction, multi-color imaging, MPS 3D hardware and AI to reduce false calls, improve first-pass yields and optimize defect detection.
Meister D+ True3D inspection system is for chiplets and system-in-package devices, including die and surface mount components.
Press Releases
- Indium Corporation Technical Expert to Present at SiP Conference China
- Flex Announces Kevin Krumm as Chief Financial Officer
- Green Circuits Enhances Inspection Capabilities with New DAGE Quadra 5 Pro X-ray System
- Western Digital CEO David Goeckeler Elected Chair of Semiconductor Industry Association