MYPro I series 3-D AOI offers redesigned ergonomics, as well as new programming tools that reduce programming time by up to 30%.
Bonding system is designed to bond replacement circuit patterns such as surface mount pads, BGA pads, and plated hole pads to PCBs.
Sustained ring soldering module permits preassembled solder rings to be placed on and around THT pins, which are then melted by laser, piston or induction soldering, or IR emitters, hot air or thermodes.
RMCA series is AEC-qualified and has excellent long-term reliability for automotive applications.
