Draloric RCC1206 e3 thick-film chip resistor in 1206 case size now has higher power rating of 0.5W.
NexygenPlus 4.1 materials testing software is for testing physical properties of raw material prior to processing, and for development of new electronics design and functionality.
3880-II die bonder includes options to maximize productivity, reduce programming time by up to 95% and improve bonder productivity.
Thin film wraparound PHPA series resistors have power ratings of 1.0W and 2.5W in 1206 and 2512 case sizes, respectively, with a self-passivated tantalum nitride film for moisture resistance.
9771 conformal coating is for use on printed circuit boards in missiles, satellites, and spacecraft. Is dual-cure and reworkable, and cures with light and moisture to ensure material that flows underneath components on PCBs fully cures.
3Di-LS2-CASE 3-D AOI has unique, highly rigid gantry structure and AI-based inspection automation functionality reduce false calls for solder defects (non-wetting) and improves speed and accuracy of solder defect detection.
