Etimol SW 25/FD RAN cleaning agent is drying-optimized and has been developed for SMT stencil washing systems that have no or insufficient heating or drying.
EP5G-80 is a one-component, NASA low outgassing rated epoxy with temp. cure requirement of 80°C for 4 hr.
i-Cube10 (YRH10) hybrid placer has surface mounter functions for electronic components and a die bonder for wafer components.
Double-sided, molded ball grid array is for 5G RF module design, characterization and packaging technology.
UV500-2 high solids UV dual-cure elastomeric acrylate conformal coating is for automotive applications.
AHC series SMT hybrid electrolytic aluminum capacitors are available in five case sizes: 0608, 0609, 0810, 0812, and 1010.
Press Releases
- Indium Corporation Technical Expert to Present at SiP Conference China
- Flex Announces Kevin Krumm as Chief Financial Officer
- Green Circuits Enhances Inspection Capabilities with New DAGE Quadra 5 Pro X-ray System
- Western Digital CEO David Goeckeler Elected Chair of Semiconductor Industry Association