YRi-V 3-D hybrid AOI features a newly developed inspection head equipped with a high-speed, high-resolution camera, extending existing 12μm and 7μm resolution lenses with a new 5μm resolution lens. High-precision 8-direction 3-D projector offers greater component inspection compatibility thanks to new coaxial lighting, improving measurement accuracy and range by 100% compared to current models and high-precision measurement now possible for up to 25mm in height. Revised conveyors handle more compatible PCB lengths. AI-powered deep learning simplifies, automates and lowers skill requirements for inspection data creation, conversion, tuning, etc. Offers greater detection capability for 0201 size (0.25mm x 0.125mm) components and mirror-glossed components.
Yamaha SMT Section
TO263-7L package includes BM2SC12xFP2-LBZ AC/DC converter ICs with built-in 1700V SiC MOSFET.
GT90 and GT120 soldering systems have software upgrades that offer combination of inductive heating technology with adjustable temperature control.
PolyStyle ESD flooring is designed for industrial and production areas, warehouses and high-traffic aisles.
APT-1400F-SL-A flying probe test system for assembled PCBAs delivers larger testing area (635 x 610mm) to accommodate 5G communications and battery management system applications.
Loctite Ablestik ABP 8068TD high thermal die attach paste is for use in applications where no die back-side metallization is required.
Press Releases
- Indium Corporation Technical Expert to Present at SiP Conference China
- Flex Announces Kevin Krumm as Chief Financial Officer
- Green Circuits Enhances Inspection Capabilities with New DAGE Quadra 5 Pro X-ray System
- Western Digital CEO David Goeckeler Elected Chair of Semiconductor Industry Association