Solderstar VP Nano captures thermal profiles of electronics assemblies that use numerous components or require higher mass PCB substrates.
ISO-Spector M2 inline 3-D AOI system with artificial intelligence is for high-end electronics assembly.
Draloric RCV-AT e3 thick-film chip resistors are AEC-Q200-qualified and have operating voltages up to 3kV in 2010 and 2512 case sizes.
Vivid Cure LCD edge bonding adhesives are for high-speed LCD display assembly and are compatible with HumiSeal face bonding products.
Intelli-Pro AI smart factory automation software and algorithm package is designed for improving performance of AOI machines.
Press Releases
- Indium Corporation Technical Expert to Present at SiP Conference China
- Flex Announces Kevin Krumm as Chief Financial Officer
- Green Circuits Enhances Inspection Capabilities with New DAGE Quadra 5 Pro X-ray System
- Western Digital CEO David Goeckeler Elected Chair of Semiconductor Industry Association