BEST Inc. has developed a simpler process for reworking or hand-placing high lead count connectors. The StencilQuik polyimide stay-in-place stencil helps rework high-density connectors by preventing bridging of neighboring solder joints while allowing technicians to “fit” connector contacts into the stencil.
Available in both 4 and 8 mil (0.10 to 0.20 mm) thickness. The stay-in-place feature means no compromising in solder paste volume. Each stencil is custom engineered to the application at hand. Deliveries are five business days with 24 to 48 hr. expedites available.
Business Electronics Soldering Technologies (BEST), www.solder.net
The process of placing or reworking the connector has been simplified. After preparing the site, the stencil is peeled from its release liner. It is then aligned on the circuit board. Solder paste is then squeegeed into the apertures of the stencil with the remaining material wiped away with a lint-free cloth. The connector is “fitted” into the loaded apertures and then reflowed. Any mask damage ensuing from device removal is repaired by placing the device onto the board.
“Repair depots and rework operations of electronic assemblers are raving about the time that they save and the quality of the rework using StencilQuik™ on hard to rework 50 plus pin connectors. In addition, hardware developers like the fact that to can easily place the more complex connectors on their development board on their own.” said Bob Wettermann of BEST Inc.
Available in both 4 and 8 mil (0.10 to 0.20 mm) thickness. The stay-in-place feature means no compromising in solder paste volume. Each stencil is custom engineered to the application at hand. Deliveries are five business days with 24 to 48 hr. expedites available.
Business Electronics Soldering Technologies (BEST), www.solder.net
ENDICOTT, NY— Endicott Interconnect Technologies has been awarded several new contracts for fabrication of wire bond PBGA substrates resulting from alliances with Silicon Valley-based companies Singulated Technology and CORWIL Technology Corp.
EI will provide wire bond PBGA substrates per Singulated Technology’s design specifications and CORWIL will provide the module assembly. End customers for these semiconductor modules use them in military, commercial and wireless electronics applications.
“This unique approach aligns best-in-class suppliers of substrate design, fabrication and assembly to produce superior finished products for low to mid volume applications where time-to-market is a critical factor in winning the business,” said James J. McNamara Jr., president and CEO of EI. “The EI team is very excited about the opportunity to partner with industry innovators, Singulated and CORWIL, and to provide substrates that add differentiating value.”
“This unique approach aligns best-in-class suppliers of substrate design, fabrication and assembly to produce superior finished products for low to mid volume applications where time-to-market is a critical factor in winning the business,” said James J. McNamara Jr., president and CEO of EI. “The EI team is very excited about the opportunity to partner with industry innovators, Singulated and CORWIL, and to provide substrates that add differentiating value.”
BP Microsystems has released BP Win 4.60, which features increased throughput on all 7th Generation automated programming systems.
By altering the site sequence prioritization routine to allow the autohandler to pick and place parts more efficiently, the 4710 and 4700 programmers can now program up to 1,400 devices/hr. (dph), an increase from 1,200 dph. On-the-fly vision system is helpful when handling fine-pitched devices and VSP devices.
The 3710 and 3700 programmers can now program up to 1,100 dph, up from 950 dph.
All 4710, 4700, 3710 and 3700 customers with a current software support contract can download the new software through the Web site.
BP Microsystems, bpmicro.com
By altering the site sequence prioritization routine to allow the autohandler to pick and place parts more efficiently, the 4710 and 4700 programmers can now program up to 1,400 devices/hr. (dph), an increase from 1,200 dph. On-the-fly vision system is helpful when handling fine-pitched devices and VSP devices.
The 3710 and 3700 programmers can now program up to 1,100 dph, up from 950 dph.
All 4710, 4700, 3710 and 3700 customers with a current software support contract can download the new software through the Web site.
BP Microsystems, bpmicro.com
Leica EZ4 StereoZoom can achieve sharp, clear images with light as bright as fiber optic illumination. Five integrated LEDs can be switched individually, dimmed and combined with transmitted light. Daylight 6500°K color temperature remains constant; true colors are preserved. Three-way incident light technology provides illumination to view samples from strongly structured objects to flat probes. LEDs have a 25,000-hour service life, which means no more bulbs to replace. The LEDs stay cool; microorganisms and plant samples are protected.
Other features include:
Image transfer is easy; PC connection is not required. Insert an SD card to record images, then upload to a PC via a card reader, projector or video recorder.
4.4:1 zoom ratio provides magnification range from 8-35X (with 10X eyepieces).
3 EZ4 versions are available: Integrated 10X/20 high eyepoint eyepieces; integrated 16X/15 high eyepoint eyepieces; and open eyetubes.
Eyetube angle of 60°.
100 mm working distance for easy access to specimens.
No removable parts.
100V to 240V integrated universal power supply.
The complete E-Series product line is designed to provide high-quality image, color and detail fidelity combined with mechanical precision for decades of maintenance-free functionality.
Leica Microsystems Inc., leica-microsystems.us
Other features include:
Image transfer is easy; PC connection is not required. Insert an SD card to record images, then upload to a PC via a card reader, projector or video recorder.
4.4:1 zoom ratio provides magnification range from 8-35X (with 10X eyepieces).
3 EZ4 versions are available: Integrated 10X/20 high eyepoint eyepieces; integrated 16X/15 high eyepoint eyepieces; and open eyetubes.
Eyetube angle of 60°.
100 mm working distance for easy access to specimens.
No removable parts.
100V to 240V integrated universal power supply.
The complete E-Series product line is designed to provide high-quality image, color and detail fidelity combined with mechanical precision for decades of maintenance-free functionality.
Leica Microsystems Inc., leica-microsystems.us
Promation is offering an enhanced option on all of its PCB handling equipment that tracks and displays the operational sequence of the station through its various functions. The option also includes automatic width adjustment, offset width adjusting, password protection and error tracking.
Additional features of the Signature Series include: manual mode operation (can operate independent features of the system with the press of a button), PCB counter (tracks the number of products passed) and Auto mode(for production run).
Promation, pro-mation-inc.com
The 15th version of GerbTool has a host of new features and technology, such as HyperNETLIST generation, that have been handed down from VisualCAM. It increases netlist generation performance over competitive tools by 5 to 10X.
• HyperNETLIST Comparison performance has been increased 5X over previous releases, while Draw-to-Flash Conversion has been increased 5-10X.
• Pin-Point Error feature reduces user effort when trying to locate a Short or Open condition.
• Automatic Draw-to-Flash conversion function reduces “hands-on” user time.
• Improvements to Paste Mask Stencil Enhancement offer more control during shape replacement. Increased control minimizes the iterations required to achieve desired mask results.
• For Release May 15th, 2006
Includes 100+ additional enhancements to existing features, ranging from improvements to Gerber file handling to better handling of previous users’ settings when upgrading.
Has revised product configurations for GT-Communicator, GT-Inspector, and GT-Designer to include support for ODB++, ODB++ (X) and IPC-2581. All of these interfaces will cover both importing and exporting.
WISE Software Solutions, wssi.com
This release contains a series of enhancements to help users increase throughput.
• HyperNETLIST Comparison performance has been increased 5X over previous releases, while Draw-to-Flash Conversion has been increased 5-10X.
• Pin-Point Error feature reduces user effort when trying to locate a Short or Open condition.
• Automatic Draw-to-Flash conversion function reduces “hands-on” user time.
• Improvements to Paste Mask Stencil Enhancement offer more control during shape replacement. Increased control minimizes the iterations required to achieve desired mask results.
• For Release May 15th, 2006
Includes 100+ additional enhancements to existing features, ranging from improvements to Gerber file handling to better handling of previous users’ settings when upgrading.
Has revised product configurations for GT-Communicator, GT-Inspector, and GT-Designer to include support for ODB++, ODB++ (X) and IPC-2581. All of these interfaces will cover both importing and exporting.
WISE Software Solutions, wssi.com
