Photo Stencil announces the results of Universal SMT Laboratories’ independent, extensive study, conducted in February 2006. The print-process study isolated the stencil alone to determine performance differences among a group of stencils manufactured by other stencil suppliers. Photo Stencil’s AMTX E-FABstencil performed the best out of 12 stencils tested, provided by five different stencil manufacturers. The Xerox-authorized stencil manufacturer usse the AMTX Electroform stencil technology, licensed under U. S. Patents owned by Xerox and acquired by Photo Stencil in 1998. The study included five electroform stencils and seven laser stencils, including Photo Stencil’s proprietary NicAlloy stencil. The report contains extensive data on the solder volume data for a range of SMT devices and aperture designs. Solder paste deposit heights, area and volume were measured for over 154,000 solder paste bricks. Solder paste volume and paste volume repeatability were measured for 16 SMT components in all 12 stencils. Both Pb-free and SnPb solder paste were used in the study. Stencils were ranked in paste volume delivery performance as well as paste volume repeatability. Photo Stencil’s E-FAB stencil provided the best paste transfer for both solder pastes among all stencils tested. NicAlloy was in second place for paste transfer. The yield analysis program was used to determine the yield loss due to open defects of BGA and microBGA packages directly attributed to the stencil. The results show that compared to the best stencil, the increase in repair costs vary from an additional $658 for the second best to an additional $10,122 for the last place stencil. E-FAB provided the lowest rework cost for both solder pastes among all 12 stencils tested, with NicAlloy again coming in second.
BEST Inc. has developed a simpler process for reworking or hand-placing high lead count connectors. The StencilQuik polyimide stay-in-place stencil helps rework high-density connectors by preventing bridging of neighboring solder joints while allowing technicians to “fit” connector contacts into the stencil.
The process of placing or reworking the connector has been simplified. After preparing the site, the stencil is peeled from its release liner. It is then aligned on the circuit board. Solder paste is then squeegeed into the apertures of the stencil with the remaining material wiped away with a lint-free cloth. The connector is “fitted” into the loaded apertures and then reflowed. Any mask damage ensuing from device removal is repaired by placing the device onto the board.
“Repair depots and rework operations of electronic assemblers are raving about the time that they save and the quality of the rework using StencilQuik™ on hard to rework 50 plus pin connectors. In addition, hardware developers like the fact that to can easily place the more complex connectors on their development board on their own.” said Bob Wettermann of BEST Inc.
Available in both 4 and 8 mil (0.10 to 0.20 mm) thickness. The stay-in-place feature means no compromising in solder paste volume. Each stencil is custom engineered to the application at hand. Deliveries are five business days with 24 to 48 hr. expedites available.
Business Electronics Soldering Technologies (BEST), www.solder.net
ENDICOTT, NY— Endicott Interconnect Technologies has been awarded several new contracts for fabrication of wire bond PBGA substrates resulting from alliances with Silicon Valley-based companies Singulated Technology and CORWIL Technology Corp.
EI will provide wire bond PBGA substrates per Singulated Technology’s design specifications and CORWIL will provide the module assembly. End customers for these semiconductor modules use them in military, commercial and wireless electronics applications.
“This unique approach aligns best-in-class suppliers of substrate design, fabrication and assembly to produce superior finished products for low to mid volume applications where time-to-market is a critical factor in winning the business,” said James J. McNamara Jr., president and CEO of EI. “The EI team is very excited about the opportunity to partner with industry innovators, Singulated and CORWIL, and to provide substrates that add differentiating value.”
BP Microsystems has released BP Win 4.60, which features increased throughput on all 7th Generation automated programming systems.
By altering the site sequence prioritization routine to allow the autohandler to pick and place parts more efficiently, the 4710 and 4700 programmers can now program up to 1,400 devices/hr. (dph), an increase from 1,200 dph. On-the-fly vision system is helpful when handling fine-pitched devices and VSP devices.
The 3710 and 3700 programmers can now program up to 1,100 dph, up from 950 dph.
All 4710, 4700, 3710 and 3700 customers with a current software support contract can download the new software through the Web site.
Leica EZ4 StereoZoom can achieve sharp, clear images with light as bright as fiber optic illumination. Five integrated LEDs can be switched individually, dimmed and combined with transmitted light. Daylight 6500°K color temperature remains constant; true colors are preserved. Three-way incident light technology provides illumination to view samples from strongly structured objects to flat probes. LEDs have a 25,000-hour service life, which means no more bulbs to replace. The LEDs stay cool; microorganisms and plant samples are protected.
Other features include: Image transfer is easy; PC connection is not required. Insert an SD card to record images, then upload to a PC via a card reader, projector or video recorder. 4.4:1 zoom ratio provides magnification range from 8-35X (with 10X eyepieces). 3 EZ4 versions are available: Integrated 10X/20 high eyepoint eyepieces; integrated 16X/15 high eyepoint eyepieces; and open eyetubes. Eyetube angle of 60°. 100 mm working distance for easy access to specimens. No removable parts. 100V to 240V integrated universal power supply.
The complete E-Series product line is designed to provide high-quality image, color and detail fidelity combined with mechanical precision for decades of maintenance-free functionality.
Promation is offering an enhanced option on all of its PCB handling equipment that tracks and displays the operational sequence of the station through its various functions. The option also includes automatic width adjustment, offset width adjusting, password protection and error tracking.
Additional features of the Signature Series include: manual mode operation (can operate independent features of the system with the press of a button), PCB counter (tracks the number of products passed) and Auto mode(for production run).