ESSEMTEC will display the HLX Series, a high-performance placement system series for flexible SMT manufacturing at SMT/Hybrid/Packaging on May 30 to June 1.
The series features production speeds up to 22,000 cph and a large feeder capacity (192 tape and stick feeders). 16 JEDEC trays can be used without loss of any feeder space. The series is comprised of the HLX8100 and HLX8200. Can be changed over during operation-- without standstill. On-the-fly setup modification ensures maximum machine load even with small productions series. Linear drives are maintenance-free, fast and precise. They position the placement heads precisely in the x- and y-axes. During placement, the board is fixed.
“Collect & Place” method enables high-placement performance. HLX8100 comes with one placement head with four vacuum nozzles and HLX8200 has two placement heads with a total of eight nozzles working in parallel. Cognex Vision (SMD4) enables precise, fast alignment, and checking of components. With transparent lighting, illumination is independent of component type and image analysis is reliable.
All feeders are exchangeable and refillable during operation. The systems are optimized immediately after every feeder change.
Are laid out for rugged, long-term operation at three-shift workdays. The chassis and wear-resistant linear drives allow for high acceleration of placement heads. The gantry system permits the simultaneous operation of two placement heads in parallel. While one head retrieves four components, the other uses this time slot for placement.
ESSEMTEC, essemtec.com
SMT/Hybrid/Packaging Hall 7, Stand 203
The series features production speeds up to 22,000 cph and a large feeder capacity (192 tape and stick feeders). 16 JEDEC trays can be used without loss of any feeder space. The series is comprised of the HLX8100 and HLX8200. Can be changed over during operation-- without standstill. On-the-fly setup modification ensures maximum machine load even with small productions series. Linear drives are maintenance-free, fast and precise. They position the placement heads precisely in the x- and y-axes. During placement, the board is fixed.
“Collect & Place” method enables high-placement performance. HLX8100 comes with one placement head with four vacuum nozzles and HLX8200 has two placement heads with a total of eight nozzles working in parallel. Cognex Vision (SMD4) enables precise, fast alignment, and checking of components. With transparent lighting, illumination is independent of component type and image analysis is reliable.
All feeders are exchangeable and refillable during operation. The systems are optimized immediately after every feeder change.
Are laid out for rugged, long-term operation at three-shift workdays. The chassis and wear-resistant linear drives allow for high acceleration of placement heads. The gantry system permits the simultaneous operation of two placement heads in parallel. While one head retrieves four components, the other uses this time slot for placement.
ESSEMTEC, essemtec.com
SMT/Hybrid/Packaging Hall 7, Stand 203
VacuNest Shape Memory Tooling combines the benefits of a custom tooling plate with the versatility of pins. An antistatic membrane covers a foam former surrounded by polymer granules. Place a golden board onto the modules, press down, pull a vacuum and the memory of the board shape profile is held. The chambers are profiled to the shape of the underside of the board ¾ on activation of the vacuum this shape is now held. Simple, secure and a custom board support is created within seconds. The shape will be held for weeks/days/months until the vacuum is released, whereupon the modules return to their original form, awaiting a new set up for the next version of board.
Advantages include: no risk damage to a component due to the pin/printing pressure, support forces evenly spread over the entire board, firm and precise support, ease of use, no dedicated tooling and short payback period, and the tool can be simply reset when a board version changes.
Can handle high-density boards and requires little to no lead-time.
Applys firm force consistently to the entire board. Guarantees board flatness and is not sensitive to solder paste contamination.
Novatec, novatec-eap.com
Booth 8-207
Advantages include: no risk damage to a component due to the pin/printing pressure, support forces evenly spread over the entire board, firm and precise support, ease of use, no dedicated tooling and short payback period, and the tool can be simply reset when a board version changes.
Can handle high-density boards and requires little to no lead-time.
Applys firm force consistently to the entire board. Guarantees board flatness and is not sensitive to solder paste contamination.
Novatec, novatec-eap.com
Booth 8-207
The 23" SP200 avi inline stencil printer is designed for medium and high throughput, high-mix applications.
Uses a “look down, look down” approach to vision alignment. Twin roving cameras mounted on independent X-Y gantries ensure accurate, repeatable precision alignment using fiducial marks or PCB/stencil features. This facilitates a “paste on stencil” inspection feature to determine if adequate paste is on the stencil before running the print cycle.
Selective Auto-Paste Dispense technology is fully programmable. The advanced intelligence of the twin camera vision system analyzes the stencil to see where paste is required, and the dispenser deposits it accordingly.
The user interface runs under a menu-driven, Windows XP application and is simple to operate. Incorporates comprehensive self-diagnostic capabilities, including production logging and automatic fault report generation
Data stored on the machine may be accessed remotely via a PC modem connection, allowing for “on the fly” troubleshooting. Automatic rail width adjust is standard to help with quick changeovers. Stencil loading is automatic; does not require adaptors for varying sizes of stencil frames.
Speedprint Technology, speedprint-tech.com
Hall 7, Stand 116 (with ANS-Answer Elektronik)
Uses a “look down, look down” approach to vision alignment. Twin roving cameras mounted on independent X-Y gantries ensure accurate, repeatable precision alignment using fiducial marks or PCB/stencil features. This facilitates a “paste on stencil” inspection feature to determine if adequate paste is on the stencil before running the print cycle.
Selective Auto-Paste Dispense technology is fully programmable. The advanced intelligence of the twin camera vision system analyzes the stencil to see where paste is required, and the dispenser deposits it accordingly.
The user interface runs under a menu-driven, Windows XP application and is simple to operate. Incorporates comprehensive self-diagnostic capabilities, including production logging and automatic fault report generation
Data stored on the machine may be accessed remotely via a PC modem connection, allowing for “on the fly” troubleshooting. Automatic rail width adjust is standard to help with quick changeovers. Stencil loading is automatic; does not require adaptors for varying sizes of stencil frames.
Speedprint Technology, speedprint-tech.com
Hall 7, Stand 116 (with ANS-Answer Elektronik)
Simple Green Stencil and Misprint Cleaner reportedly combines effective results with a high level of user and environmental safety associated with Simple Green products.
Michael Konrad, president, said, “Simple Green Stencil and Misprint Cleaner is simply the best solder paste remover we have ever seen. I have never before seen a stencil cleaning chemical clean so quickly and rinse so effortlessly.”
Is designed for use in immersion stencil cleaning systems such as ultrasonic stencil cleaners and is also available in a trigger spray for manual stencil cleaning applications.
Offering lower health and safety risks than traditional solvent-based cleaners, and better cleaning efficiency than current aqueous-based cleaners, it complies with the most stringent (SCAQMD) VOC regulations when used as directed.
Aqueous Technologies Corp., aqueoustech.com
Michael Konrad, president, said, “Simple Green Stencil and Misprint Cleaner is simply the best solder paste remover we have ever seen. I have never before seen a stencil cleaning chemical clean so quickly and rinse so effortlessly.”
Is designed for use in immersion stencil cleaning systems such as ultrasonic stencil cleaners and is also available in a trigger spray for manual stencil cleaning applications.
Offering lower health and safety risks than traditional solvent-based cleaners, and better cleaning efficiency than current aqueous-based cleaners, it complies with the most stringent (SCAQMD) VOC regulations when used as directed.
Aqueous Technologies Corp., aqueoustech.com
FLX500 is a self-contained, automated device programmer that fits on a desktop. The system will be introduced at Nepcon UK and Semicon Singapore next week.
“Customers constantly share with us the costly problems they have with gang programmers – bent leads, blank devices, incorrectly programmed devices, high levels of scrap – but at the same time they often do not have the facilities, the operators, the time for training, or the physical space required for a sophisticated automated programming system,” said Megan Miller, director of marketing. “The FLX500 offers a solution that drastically reduces the errors and waste inherent in manual programming. The FLX500 is modular and expandable, it supports virtually all device packages, and it is ideally sized to fit almost anywhere.”
Enables ‘plug and program’ automated programming. Touch screen user interface is language independent, eliminating operator training and mistakes. Requires no special installation. Can be plugged into a standard wall outlet. Self-contained air supply eliminates the need for an external air system. Picks devices from tray media, places them in sockets for programming, and returns programmed devices to output trays.
Has FlashCORE precision programming technology, with high-speed programming for leading Flash and serial memory devices, NAND flash and programmable microcontrollers. Supports BGA, mBGA, CSP, PLCC, TSOP, QFP and others, with throughput over 500 devices/hr.
A flexible rental option allows EMS companies, for example, the flexibility needed to meet short-term or volatile contract requirements without a major capital investment.
Data I/O Corp., www.dataio.com
NEPCON, UK
Booth G37 (with Accelonix)
Semicon, Singapore
Booth 928 (with TransTechnology PTE Ltd.)
“Customers constantly share with us the costly problems they have with gang programmers – bent leads, blank devices, incorrectly programmed devices, high levels of scrap – but at the same time they often do not have the facilities, the operators, the time for training, or the physical space required for a sophisticated automated programming system,” said Megan Miller, director of marketing. “The FLX500 offers a solution that drastically reduces the errors and waste inherent in manual programming. The FLX500 is modular and expandable, it supports virtually all device packages, and it is ideally sized to fit almost anywhere.”
Enables ‘plug and program’ automated programming. Touch screen user interface is language independent, eliminating operator training and mistakes. Requires no special installation. Can be plugged into a standard wall outlet. Self-contained air supply eliminates the need for an external air system. Picks devices from tray media, places them in sockets for programming, and returns programmed devices to output trays.
Has FlashCORE precision programming technology, with high-speed programming for leading Flash and serial memory devices, NAND flash and programmable microcontrollers. Supports BGA, mBGA, CSP, PLCC, TSOP, QFP and others, with throughput over 500 devices/hr.
A flexible rental option allows EMS companies, for example, the flexibility needed to meet short-term or volatile contract requirements without a major capital investment.
Data I/O Corp., www.dataio.com
NEPCON, UK
Booth G37 (with Accelonix)
Semicon, Singapore
Booth 928 (with TransTechnology PTE Ltd.)
Alphasem has introduced a tape applicator module for the Swissline 9022 die bonder series. Offers process control and high productivity.
In a recent benchmark test conducted by a leading Korean chipmaker, the new tape applicator outperformed its competitors. The general manager responsible for the manufacturing plant at which the evaluation took place, said: "The new Alphasem tape applicator module really exceeded our expectations. Its unparalleled performance ideally suits our requirements and helps us to secure our leadership in manufacturing stacked-die devices."
Allows simple, fast adaptation to varying production needs. The possible combination of tape applicator module and epoxy dispenser on one die bonder eliminates time-consuming exchange of modules.
Inspection capabilities guarantee product integrity.
Available with factory-built Swissline 9022 die bonders. Field upgrades for recently installed Swissline 9022 die bonders available on request.
In a recent benchmark test conducted by a leading Korean chipmaker, the new tape applicator outperformed its competitors. The general manager responsible for the manufacturing plant at which the evaluation took place, said: "The new Alphasem tape applicator module really exceeded our expectations. Its unparalleled performance ideally suits our requirements and helps us to secure our leadership in manufacturing stacked-die devices."
Allows simple, fast adaptation to varying production needs. The possible combination of tape applicator module and epoxy dispenser on one die bonder eliminates time-consuming exchange of modules.
Inspection capabilities guarantee product integrity.
Available with factory-built Swissline 9022 die bonders. Field upgrades for recently installed Swissline 9022 die bonders available on request.
Alphasem AG, alphasem.com
