Essemtec will display SP200-AV, a fine-pitch printer with automatic vision adjustment, at the upcoming Nepcon U.K. show.
The easy-to-operate semiautomatic printing machine controls and regulates all printing parameters. The only manual task is to slide the PCB into the machine. All other operations, including the positioning of the PCB, are fully automatic and reproducible. Designed for serial production but can also be used for small batches.
Benefits include a fast two-point vision system, automatic PCB positioning with vision, automatic printing process, automatic stencil cleanliness check and fast PCB loading with side drawer. Provides an unlimited number of printing programs, an integrated operation manual, simple changeover between jobs and Windows XP software. All printing parameters are programmable.
ESSEMTEC AG, www.essemtec.com
The easy-to-operate semiautomatic printing machine controls and regulates all printing parameters. The only manual task is to slide the PCB into the machine. All other operations, including the positioning of the PCB, are fully automatic and reproducible. Designed for serial production but can also be used for small batches.
Benefits include a fast two-point vision system, automatic PCB positioning with vision, automatic printing process, automatic stencil cleanliness check and fast PCB loading with side drawer. Provides an unlimited number of printing programs, an integrated operation manual, simple changeover between jobs and Windows XP software. All printing parameters are programmable.
ESSEMTEC AG, www.essemtec.com
Nepcon UK Booth D20
Xpress 25 SMT placement system combines high-speed and fine-pitch capabilities within a compact footprint. The twin headed system can place devices ranging from 0201 to 50 x 50 mm QFP (70 x 70 mm QFP and 100 mm connector optional) at a tact time of 0.144 sec (25,000 cph equivalent, IPC: 18,900 cph). Equipped with “smart nozzles” and on the fly vision.
Has feeder capacity of 92 x 8 mm and accuracy of ±0.06 mm (QFP) to ±0.1 mm (chip) at 4 sigma. Features a minimum pitch of 0.4 mm (0.3 mm optional) and a tape size range of 8 to 88 mm.
Options include: intelligent tape feeders, intelligent tape trolley, intelligent belt feeders, intelligent vibratory feeders, intelligent internal matrix tray, intelligent matrix tray sequencer, passive tape trolley, offline storage trolley, component verification, barcode reader, fixed upward vision camera and software.
Europlacer, europlacer.com
Nepcon UK Booth C10
Has feeder capacity of 92 x 8 mm and accuracy of ±0.06 mm (QFP) to ±0.1 mm (chip) at 4 sigma. Features a minimum pitch of 0.4 mm (0.3 mm optional) and a tape size range of 8 to 88 mm.
Options include: intelligent tape feeders, intelligent tape trolley, intelligent belt feeders, intelligent vibratory feeders, intelligent internal matrix tray, intelligent matrix tray sequencer, passive tape trolley, offline storage trolley, component verification, barcode reader, fixed upward vision camera and software.
Europlacer, europlacer.com
Nepcon UK Booth C10
The EVS 3000 and EVS 6000 systems are part of the EVS Series.
Offering capacities of 10 kg/20 lbs (EVS 3000) up to 20 kg/44 lbs (EVS 6000), the machines have (in most cases) the facility for single operation dedrossing of even large wave soldering machines. Large integrated hopper makes rapid transfer of dross simpler and safer, and reportedly speeds dedrossing times by up to 50%.
In the enclosed automated system, hot dross is loaded into the large hopper and sealed into the machine. The process recovers the solder into a solder tray in the form of ingots that are easily placed back into the solder pot and deposits the spent dross automatically through a chute to a covered dross bin. Air is extracted via a standalone, four-part filtration system.
A Hopper Extraction System prevents the escape of any fumes and dust that may be generated when loading. An automatic air-knife cools the molten solder ingots until they are safe to handle. Premature removal of the ingot tray is prevented by a safety lock. Handling and moving of dross is reduced to a minimum as it is contained until it is automatically ejected into the dross bucket.
Safety features are built into the machine to protect against misuse and abuse.
EVS International, solderrecovery.com
Nepcon UK Booth G5
Offering capacities of 10 kg/20 lbs (EVS 3000) up to 20 kg/44 lbs (EVS 6000), the machines have (in most cases) the facility for single operation dedrossing of even large wave soldering machines. Large integrated hopper makes rapid transfer of dross simpler and safer, and reportedly speeds dedrossing times by up to 50%.
In the enclosed automated system, hot dross is loaded into the large hopper and sealed into the machine. The process recovers the solder into a solder tray in the form of ingots that are easily placed back into the solder pot and deposits the spent dross automatically through a chute to a covered dross bin. Air is extracted via a standalone, four-part filtration system.
A Hopper Extraction System prevents the escape of any fumes and dust that may be generated when loading. An automatic air-knife cools the molten solder ingots until they are safe to handle. Premature removal of the ingot tray is prevented by a safety lock. Handling and moving of dross is reduced to a minimum as it is contained until it is automatically ejected into the dross bucket.
Safety features are built into the machine to protect against misuse and abuse.
EVS International, solderrecovery.com
Nepcon UK Booth G5
Speedprint Technology, a division of Blakell Europlacer Group, will display SP200avi inline stencil printer at the upcoming Nepcon trade show in Birmingham, U.K.
Designed for medium- and high-throughput, high-mix applications, the 23" inline stencil printer uses a patented “look down, look down” approach to vision alignment. Twin roving cameras mounted on independent X-Y gantries ensure precision alignment using fiducial marks or PCB/stencil features. The vision system facilitates a “paste on stencil” inspection feature that helps determine if there is adequate paste on the stencil before running the print cycle.
Selective Auto-Paste Dispense technology is fully programmable. The twin camera vision system analyzes the stencil to see where paste is required, and the dispenser deposits it accordingly. This reportedly guarantees consistent solder paste deposition onto PCBs.
The user interface runs under a menu-driven Windows XP application. The software incorporates self-diagnostic capabilities, including production logging and automatic fault report generation.
Data stored on the machine may be accessed remotely via a PC modem connection, allowing for “on the fly” troubleshooting. Automatic rail width adjust is standard to help with quick changeovers in a high-mix manufacturing environment. Stencil loading is automatic; it does not require adaptors for varying sizes of stencil frames.
Speedprint Technology, speedprint-tech.com
Nepcon Birmingham Stand No. C10
Aquanox A4520T Aqueous Chemistry for Flush Mounted and Fine-pitch Components is designed to clean under low standoffs and in the tight spaces caused by smaller, more heavily populated devices. The chemistry has reportedly proven effective on all Pb-free, no-clean and eutectic materials available today, while providing a low cost of ownership.
Works at low temperatures and low concentrations while exceeding industry standards for people and environmental safety. Easy to use, is effective without sump side additives and is said to provide brilliant joints. Features a long bath life, and is RoHS compliant.
Cleans numerous soils including lead-free flux, tacky flux, reflowed paste, no-clean flux, RMA flux, OA paste, oils, fingerprints, light oxides and polymerized soils. Is multi-metal safe for use on yellow metals, aluminum, ferrous, composites and most precious metals. The biodegradable aqueous solution contains no CFCs or HAPs. Is non-flammable and non-corrosive.
Available commercially in one, five and 55 gallon containers.
Kyzen Corp., kyzen.com
Works at low temperatures and low concentrations while exceeding industry standards for people and environmental safety. Easy to use, is effective without sump side additives and is said to provide brilliant joints. Features a long bath life, and is RoHS compliant.
Cleans numerous soils including lead-free flux, tacky flux, reflowed paste, no-clean flux, RMA flux, OA paste, oils, fingerprints, light oxides and polymerized soils. Is multi-metal safe for use on yellow metals, aluminum, ferrous, composites and most precious metals. The biodegradable aqueous solution contains no CFCs or HAPs. Is non-flammable and non-corrosive.
Available commercially in one, five and 55 gallon containers.
Kyzen Corp., kyzen.com
Nepcon East booth 2000
Optilia Flexia BGA/SMT Video Inspection Microscope is an ESD-protected video microscope for look-down or look-under visual inspection of solder joints on assembled PCBs components, solder/flux mixtures, bare circuit cards/pads, cables/connectors, wire bonds and stencils.
Can be set up in seconds with either a "look-down" macro zoom lens (1-60X) or "look-under" (4X zoom) side-viewing BGA lens. Can be connected directly to a hand held monitor, PC or Laptop via high speed USB 2.0 frame grabber (included). Imaging applications include digital image capture, video recording and optical measurements. Optimized for Pb-free inspection and provides data management and documentation tools.
The side viewing lens offers the capability to look-under and inspect BGAs, µBGAs, CSP and flip-chip packages with minimal package stand-off. The BGA lens captures sharp images of the soldered balls under the BGA package up to 12 mm deep (~15-20 rows) and down to a 0.05 mm stand off. The lens allows users to perform failure analysis and confirm solder ball shape, reflow compression, wetting and flux conditions, and other visual characteristics of SMT/BGA components.
Can be set up in seconds with either a "look-down" macro zoom lens (1-60X) or "look-under" (4X zoom) side-viewing BGA lens. Can be connected directly to a hand held monitor, PC or Laptop via high speed USB 2.0 frame grabber (included). Imaging applications include digital image capture, video recording and optical measurements. Optimized for Pb-free inspection and provides data management and documentation tools.
The side viewing lens offers the capability to look-under and inspect BGAs, µBGAs, CSP and flip-chip packages with minimal package stand-off. The BGA lens captures sharp images of the soldered balls under the BGA package up to 12 mm deep (~15-20 rows) and down to a 0.05 mm stand off. The lens allows users to perform failure analysis and confirm solder ball shape, reflow compression, wetting and flux conditions, and other visual characteristics of SMT/BGA components.
Focalspot, focalspot.com
