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XJIO expansion board improves test coverage and fault diagnosis on complex printed
circuits, checks power rail levels and can eliminate custom test jigs.

The board improves the test coverage for a Unit Under Test (UUT) by verifying the signals through to the external connections. In the event of a board failure, fault diagnosis times can be reduced by as much as half, as the board eradicates the need for loopbacks and cable swapping.

Has 208 digital and 16 analogue (8xADCs and 8xDACs) I/Os, provides customers developing JTAG and non-JTAG boards with a reusable alternative to traditional test fixtures.
 
“The XJIO board was developed predominantly for testing circuits with large amounts of digital I/O such as on network cards - particularly if the board has more outputs than inputs or vice-versa,” said Dominic Plunkett, CTO. “It features over 200 digital I/Os and this density can be expanded to many thousands by daisy-chaining the XJIO boards together using the reconfigurable external JTAG connector.”

Can be powered from USB, for quick and portable test setup. If more than 80mA of current is required, there is a connector for a standard 12V power supply. All connectors are standard IDC. Switches and LEDs enable additional test control.  
  
 XJTAG, xjtag.com

Tyco Electronics’ Global Application Tooling Division (GATD) designed a customized RFID inlay assembly system for Graphic Solutions International (GSI). The equipment will assemble semiconductor chips, surface-mount devices and printed batteries onto a continuous web of printed antennas, adding RFID capability to tags and labels.
 
Working closely with GSI to meet their specifications, Tyco provided a reel-to-reel system that allows GSI to mount flip-chips, SMDs and printed batteries onto printed antennas and conductive traces. The system is capable of the high-speed mounting of electronic components on a 6,000'+ roll of 20" wide material. After conductive printing, the roll is fed into the machine where components are added along with one or two printed batteries. Upon completion, the roll can be slit into individual streams and rolled, or supplied in production web width rolls for delivery. A typical circuit is inlaid with batteries, an RFID chip, and a printed antenna. The speed of this machine allows for production levels up to 26 million inlays per year.
 
The line can accommodate printed substrates from 0.002" (50 mm) to 0.005" (125 mm) thick, mount on continuous rolls with a repeat pitch of 0.8" (20 mm) and position chips to micron accuracy.
 
Tyco Electronics, tycoelectronics.com
Graphic Solutions International LLC, graphicsolutionsinc.com
The Feinfocus Cougar-SMT with CT can image complex components in 2-D and 3-D for quality assessment and process improvement.
 
Featuring a Feinfocus GUI, it includes a microfocus x-ray tube up to 160 kV, HDX-Ray real-time 16-bit image processing, digital flat panel detector and accelerated CT reconstruction and visualization. Provides feature recognition down to 1 µm, with total magnification up to 10,000X and True X-Ray Intensity (TXI) Control.
 
Users may add features such as BGA and die-attach void calculation modules, a more sophisticated manipulator system and a multifocus x-ray tube up to 160 kV. CT functionality is an available upgrade for existing systems.
 
Features a small footprint (approx. 1 x 1 m), low system weight (approximately 1,450 kg) and convenient front- and side-door service access.
 
 
COMET, comet.ch
LF-4300 is an RoHS-compliant Pb-free solder paste with multi-process capabilities, a single product for no-clean applications that is also water washable. Compatible with Pb-free, SnPb and high-temperature alloys, the versatile and forgiving solder paste can be cleaned using standard aqueous cleaning systems without saponification.

 
Manufactured using a proprietary formula, including synthetic materials for good printing characteristics, lot-to-lot consistency and long stencil life. Is VOC and halide-free, and is classified as REL0. When used as a no-clean with either SnPb and Pb-free alloys, flux residue remains clear and meets S.I.R. requirements per IPC-TM-650.2.6.3.3.

 
Features include:

·        Complies with RoHS directive 2002/95/EC for lead-free

·        Suitable for high temp. alloys up to 300oC

·        No mid-chip beading

·        Low voiding

·        12-hour stencil life

·        24-hour abandonment time

·        Pin Probable for ICT inspection

·        Compatible with AOI inspection

·        Works well in a vapor phase process

 

ALPHA OM-338 PT lead-free no-clean solder paste is said to offer unparalleled pin testability, while allowing high print speeds and delivering excellent throughput and yield.
 
“Lead-free pastes have an inherent difficulty with pin test yields… [but] OM-338 PT has proven to be a very promising innovation,” said Mitch Holtzer, global product manager. “Alpha OM-338 PT is targeted to both EMS and OEM customers using in-line circuit testing. It was developed to reduce the number of false negatives recorded when pin probes are used, resulting in increased throughput and yield.”
 
In addition to excellent pintestability with virtually no residue on pins, it offers high print speeds (up to 150 mm/sec., on 12 mil squares and 10 mil circles), compatibility with both Rheopump and Pro-Flow, electrical reliability (passes IPC, Bellcore and HP requirements), clear, colorless flux residue yielding excellent joint appearance, and low voiding and anti-slumping characteristics.
 
Cookson Electronics, newalphaproducts.com
BP Microsystems will highlight the Helix, the latest addition to its automated device programmer family, at the upcoming SMT/Hybrid/Packaging exhibition in Nuremberg, Germany. Also on display: ISP-PRO socket module and manual programming systems.

The Helix desktop automated system comes with two precision-designed tube input and output handling systems. Integrated in the handler are two 7th Generation programming sites with FX socket module capability. This allows for programming up to four devices simultaneously per site. Can handle MSOP, SOIC, PLCC, SSOP and TSSOP. A tray-only version will be available at a later date. 
 
ISP-PRO socket module was designed to provide in-circuit programming solutions. Manual programmers can be connected to the board via a cable interface using the socket module.
 
The latest manual device programmers feature high-speed USB 2.0 standard bus for improved communication speed.
 
BP Microsystems, bpmicro.com
SMT/Hybrid/Packaging Hall 9, Stand 9-532
 

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