Universal Instruments will demonstrate its latest platform placement system, the AdVantis XS, at Semicon West. Designed for the convergence of semiconductor and standard surface-mount assembly, the system deploys Universal’s VRM linear motors for accuracy and repeatability.
 

 
The linear-motor-driven system has high magnification cameras, flip-chip algorithms, low force capability, heated spindles, fluxing, dispensing, and a variety of feeder types. Is Class 1000 clean room compatible.
 
Universal Instruments, uic.com
Semicon West Booth 7039

Practical Components Inc., a distributor of dummy SMD and thru-hole components, test boards, training/setup kits and supplies, has added Thin Array Plastic Package (TAPP) to its selection. 
 
Packaging companies Amkor Technology and ASAT Holdings entered into a multi-year cross-licensing agreement to provide Amkor with a license for its TAPP semiconductor package technology.
 
“Over the past few years, the semiconductor industry has seen an extensive adoption of QFN packages, fueled in part by the success of Amkor’s proprietary MicroLeadFrame package technology and ASAT’s Leadless Plastic Chip Carrier package. We look forward to integrating ASAT’s TAPP with our MicroLeadFrame family of packages to support our growing base of customers requiring innovative QFN package solutions,” said Jim Fusaro, Amkor’s corporate VP for product management, in a statement.
 
Available TAPP solder finishes are eutectic Sn/Pb and Pb-free with lead counts from 28 to 208.  The very thin, fine-pitch package with an exposed die attach pad allows for improved thermal performance and a power/ground ring option for enhanced electrical characteristics.  
 
Practical Components is the exclusive distributor of mechanical samples for Amkor Technology as well as distributing components from most other manufacturers. 
 
Practical Components Inc., practicalcomponents.com

Syon electrically conductive adhesive solders can be used to form conductive paths in applications where hot soldering would be ineffective or impractical. The epoxy and epoxide formulations mix and pour easily, fill voids and cure with minimal air entrapment. Reportedly provide environmental and impact resistance.
 
Syon Tru-Bond 206A Conductive Adhesive Solder is a pourable liquid for bonding electrical components that could be damaged by hot solder. This silver-filled epoxide is also useful where hot solder would not bond to the types of metals or wires to be joined, as well as for microwave shielding. Pot life is one to three hours. Cure time is 72 hours at 75° F or 2 hours at 130° F.  Can be used in service temperatures from -65° to 200° F.
 
Tru-Bond 214 Adhesive is a silver-filled, nonsagging epoxy paste for applications where a conductive bond is required and where hot soldering is impractical. Can be used to form conductive paths on circuit boards and to prepare electrodes for capacitance and loss measurements. Is also for applications requiring high thermal conductivity and meets federal specification MMM-A-1931, Types I and II. Pot life is one hour; cure time is 24 hrs at room temperature. Can be used in temperatures from  -65° to 200° F.
 
Tru-Bond 215 Copper-Filled Epoxy Adhesive is both electrically and thermally conductive. An economical alternative to silver-filled products, this nonsagging paste can be used in place of hot solder in the preparation and repair of conductive paths on circuit boards and in RF shielding as well as in heat-sink applications. Has a pot life of 45 min. Although it cures at room temperature, heating the adhesive to 150° F for 2 hours speeds curing and ensures electrical conductivity. Can be used in temps from  -65° to 200° F.
 
Devcon, devcon.com

 
Imbera is a joint venture of Aspocomp Group Oyj and Elcoteq Network Corp. that is developing a production process that integrates active components inside the PCB structure. PCB manufacturing, component packaging, and assembly are incorporated into a single manufacturing process. All interconnections between the IC and substrate are processed simultaneously.
 
The thermal properties of the new technology were challenging to define because the technology is so new and is developing very rapidly. Tight schedules limited the number of prototyping runs that could be executed. Flotherm software from Flomerics is suited to this type of complicated electronics cooling problem because it is designed for electronic cooling applications. It provides a number of thermal model libraries for existing components and tools that allow users to assemble models from libraries.
 
Imbera engineers used Flotherm to model two types of IMB structures, BGA modules and ICs embedded in motherboards, in a standard still air environment. Simulations provided fundamental information about the behavior of the structure. The simulation results made it possible for Imbera engineers to optimize the various methods afforded by IMB technology to keep the product operating temperature within specifications.
 
The simulation models were validated by performing measurements with MicReD’s “T3Ster” thermal tester. It can test up to eight components at one time and analyze the results as the test is being performed.