SAN FRANCISCO - Inventories throughout the high-tech food chain are under control and look unlikely to balloon out of control over the sluggish summer months ahead of the key year-end holiday season, industry executives reported at the JPMorgan Technology Conference this week.
The comments made by chief executives and CFOs come amid growing concerns that an inventory glut in the face of potentially flagging demand will weigh on profits.
While the fourth quarter is great for electronic gadget sales because of Christmas, and firms often spend more on technology toward the end of the year to pad out annual budgets, unsold output can pile up in the intervening months.
March Plasma Systems has release of an improved version of its AP-1000 plasma system for high-volume plasma processing of semiconductor and microelectronics devices. The current system has a large installed base at customer sites worldwide, with over 200 systems currently in the field. The redesigned version provides the same production-proven plasma technology and performance in a smaller, more compact and easier-to-service design.
The system is capable of a variety of plasma modes and can handle a range of plasma gasses. March specifically designed the new system with existing customers in mind so that process re-qualification is not required when switching to the improved system. Accordingly, new system process performance is guaranteed for customers with copy-exact requirements.
March Plasma Systems, marchplasma.com
"Every square inch of clean room and manufacturing space is valuable," said Peter Bierhuis, president. "We have improved the new AP-1000 system to consume 24% less actual floor space than before, and 45% less effective floor space when you include all of the required maintenance areas. We have also moved key components to make them more accessible and easier to service. An added benefit for large-scale manufacturing facilities is that more AP-1000 systems can be placed side-by-side in a smaller area because now the chassis is smaller, there are no required maintenance areas at the sides of the system, and the plasma chamber door has been redesigned."
The system is capable of a variety of plasma modes and can handle a range of plasma gasses. March specifically designed the new system with existing customers in mind so that process re-qualification is not required when switching to the improved system. Accordingly, new system process performance is guaranteed for customers with copy-exact requirements.
March Plasma Systems, marchplasma.com
MINNEAPOLIS, MN – As part of SMTA International – co-located with ATExpo in September in Rosemont, IL – the SMTA has organized its Emerging Technologies Summit to address the latest trends in electronics manufacturing and assembly. The ET Summit, which consists of three paper sessions and a concluding panel discussion, will take place on Sept. 25.
The first session, Packaging Space: Nano to Outer, will feature papers on Emerging Trends Overview, Bonding Techniques in Wafer Fabrication, Flip-Chip Integration of a Large Format Array of MOEMS Devices for Space Infrared Astronomy, Multiscale Assembly and Packaging System for MOEMS, and Nanotechnology and Room Temperature Assembly.
The next session, Wireless Technology, will feature papers on Emerging Opportunities and Challenges for High Frequency Broadband Communications, Connecting the Unconnected – Broadband Wireless Access Technologies, and Network, WiFi, WiMax, WiMedia, WiMe? What Wireless Standards Can Bring to Sensing and Controls.
The last session, Using RFID to Add Value to Your Products and Services, will feature a presentation and demonstration of high frequency and ultra high frequency technology and their application in PCB product environments.
Moderated by Reza Ghaffarian, Ph.D., of Jet Propulsion Laboratory, the panel discussion will feature key industry participants who will respond to audience and moderator questions.
For event registration, visit smta.org/smtai.
The first session, Packaging Space: Nano to Outer, will feature papers on Emerging Trends Overview, Bonding Techniques in Wafer Fabrication, Flip-Chip Integration of a Large Format Array of MOEMS Devices for Space Infrared Astronomy, Multiscale Assembly and Packaging System for MOEMS, and Nanotechnology and Room Temperature Assembly.
The next session, Wireless Technology, will feature papers on Emerging Opportunities and Challenges for High Frequency Broadband Communications, Connecting the Unconnected – Broadband Wireless Access Technologies, and Network, WiFi, WiMax, WiMedia, WiMe? What Wireless Standards Can Bring to Sensing and Controls.
The last session, Using RFID to Add Value to Your Products and Services, will feature a presentation and demonstration of high frequency and ultra high frequency technology and their application in PCB product environments.
Moderated by Reza Ghaffarian, Ph.D., of Jet Propulsion Laboratory, the panel discussion will feature key industry participants who will respond to audience and moderator questions.
For event registration, visit smta.org/smtai.
NEW YORK -- Investors may want to be cautions when approaching shares of Sanmina-SCI, said Cowen and Company analysts Louis R. Miscioscia told Forbes. Apparently the company has had some suspicious timing of its stock options awards.
At a time when more and more technology companies are coming under investigation by the Securities and Exchange Commission for irregular stock options granting practices, Miscioscia said Sanmina's story is the "most interesting" out of all the EMS companies he covers.
LPKF recently released the bench-top ProtoFlow Oven for Pb-free reflow soldering. The new design has been influenced by the stringent process requirements of Pb-free technology, and by the prior oven model, the ZelFlow R04.
Maximum process temperature is 320°C/608°F; it incorporates four internal temperature sensors and a multiprocessor controller board, which ensure even heat distribution over PCBs up to 9 x 12”. Has several software zones between preheating and final reflow to process most reflow profiles, as well as prototyping, technology research and even pre-production testing.
An optional four additional sensors can also be freely mounted on the PCB by the operator, enabling on-board temperature to be recorded and displayed in real time on a PC through a standard USB connection. Reflow process can be observed through a large window.
Has pre-programmed process profiles, which can be easily selected using four navigation keys. Custom profiles may also be created on your PC and uploaded to the oven. Includes an LCD display and intuitive software interface. Process parameters can be exchanged with a PC, managed and archived. Microsoft Excel can be used monitor and document progress parameters for complete quality management documents.
LPKF Laser & Electronics, lpkfusa.com
Maximum process temperature is 320°C/608°F; it incorporates four internal temperature sensors and a multiprocessor controller board, which ensure even heat distribution over PCBs up to 9 x 12”. Has several software zones between preheating and final reflow to process most reflow profiles, as well as prototyping, technology research and even pre-production testing.
An optional four additional sensors can also be freely mounted on the PCB by the operator, enabling on-board temperature to be recorded and displayed in real time on a PC through a standard USB connection. Reflow process can be observed through a large window.
Has pre-programmed process profiles, which can be easily selected using four navigation keys. Custom profiles may also be created on your PC and uploaded to the oven. Includes an LCD display and intuitive software interface. Process parameters can be exchanged with a PC, managed and archived. Microsoft Excel can be used monitor and document progress parameters for complete quality management documents.
LPKF Laser & Electronics, lpkfusa.com
SCOTTSDALE, AZ -- The Field-Programmable Gate Array (FPGA) market, with a quickly expanding array of uses, is on a roll, according to a report from In-Stat. The value of worldwide FPGA shipments will increase from $1.9 billion in 2005 to $2.75 billion by 2010, the high-tech market research firm said. Much of this revenue will come from low-volume shipments.
"In large part, low-volume use of this product relates directly to price, which directly correlates to complexity, and prices can run from less that $100 per unit to several thousand dollars per unit," said Jerry Worchel, senior analyst. "End-use applications will determine the viability of using FPGAs for the long haul."
In-Stat predicts that the largest two end-use segments will be communications and industrial, whose combined market share will increase from 73.8% in 2005 to 76.8% by 2010.
"In large part, low-volume use of this product relates directly to price, which directly correlates to complexity, and prices can run from less that $100 per unit to several thousand dollars per unit," said Jerry Worchel, senior analyst. "End-use applications will determine the viability of using FPGAs for the long haul."
In-Stat predicts that the largest two end-use segments will be communications and industrial, whose combined market share will increase from 73.8% in 2005 to 76.8% by 2010.
