GÖPEL electronic introduces the SFX-5704 as additional component to the JTAG/Boundary Scan hardware platform Scanflex. The I/O Module (SFX Module) was developed for the production test of mixed-signal applications and provides four parallel and independent channels.
Can be freely combined with controllers on PCI, PXI, USB, FireWire or LAN basis as well as TAP transceivers with distances up to five metres.
Each of the four channels features a fully-fledged driver/sensor pin electronic combined with an analog measuring function. For digital tests each channel can be switched to Input, Output, Bidir or Tri State (interposing relay). Individually programmable parameters such as input-voltage (±10V), output-voltage (±10V), maximum driver current up to 300mA and programmable Pull Up and Pull Down resistors enable an application oriented test channel adaptation to the signals to be tested.
Safety measures for the Unit Under Test include automated overcurrent recognition with subsequent current limit (fold back), dynamic driver current gain adaptation (backdriving) as well as a specific clip switching for freely programmable oppression of overshoots on the connected signal lines.
The analog measuring function has an input range of ±10V at a 12 bit resolution. Analog and digital functions can simultaneously be operated at active clip switching.
B300 tabletop ultrasonic cleaner includes a stainless steel cleaning tank using industrial-style ultrasonic transducer technology, at 40KHz. Includes an automatic 15 min. timer and comes with a cover and perforated stainless steel basket.
Inside tank dimensions are 11.8 x 3.9 x 2.9”, with half-gallon capacity, in either a 115 or 230 volt unit.
Applications include difficult soils or contaminations, removing brazing fluxes, polishing compounds, lens cleaning. Ideal markets include jewelry, optical and veterinarian markets.
AccuCheck ESD inspection template allows Photo Stencil to offer precision component verification inspection templates to its customers, directly from its headquarters in Colorado Springs, CO.
“Now that the equipment is located at Photo Stencil’s facility, the company can offer full design and fabrication capabilities, as well as the timely deliveries our customers have come to expect. This is yet another in-house service that Photo Stencil has the capability to offer,” said Mike Burgess, stencil product manager.
Plastic laser-cut templates are a cost-effective and timely alternative to automated optical inspection equipment. Can be used for all board types including SMT, Pin Through Hole Technology (PHT) and combinations of both. The standard turn time is 24 to 48 hrs, depending on the verification of data received.
Multi-Seals offers an alternative to liquid epoxy for high-volume epoxy sealing applications. Uni-form epoxy preforms are one-part epoxy resins that are solid at room temperature. When heated, they melt and cure, forming a consistent seal that protects components from dust, moisture, oil, flux, solvents, conformal coatings, and other contaminants.
Features close tolerances on preform configurations, consistent pre-mixed ratios of resin to catalyst and consistent viscosity from beginning to end of batch. Preforms can be dispensed at 200 to 600 parts/min. with little or no operator training. Eliminate pot-life concerns and costly cleanup procedures. Available in a range of shapes, sizes and materials to accommodate diverse applications.
JNJ Industries’ AquaSonic AQP Solder Paste & Flux Remover has been certified by the South Coast Air Quality Management District (SCAQMD) as a Clean Air Solvent, meeting their new, more stringent requirements of 25 grams per liter or less of VOC.
It removes solder paste and flux from stencils, PCBs, tools and other surfaces quickly, effectively and safely. It is non- hazardous, non-flammable, virtually odor free, works well in ultrasonic cleaning machines and is available in concentrate form, or pre-mixed with water and ready to use.
Is more than 90% water based and all ingredients are 100% active. Removes the toughest no-clean and lead-free solder pastes, SMT epoxies and flux residues from all types of surfaces in electronic manufacturing environments and machinery.
Bishop and Associates recently released the 2006 edition of the Connector Market Handbook. The comprehensive seven-chapter report analyzes all aspects of the world electronic connector market, providing detailed connector statistics by equipment sector and product category for North America, Europe, Japan, China, Asia Pacific and the ROW.
Includes a chapter on worldwide connector industry results by region, equipment sector and product category. Data is provided for 1999-2005, with projections for 2010 (including five-year CAGRs). Includes 2004/2005 results by country for the European and Asia Pacific regions, as well as a 2010 forecast.