ARLINGTON, VA – The Electronic Components, Assemblies & Materials Association (ECA) presented awards at CARTS USA 2006, held April 3-6 in FL, for the best technical papers from the 2005 conference. The awards are based on a vote of conference attendees.
Steve Weir, Steve Weir Design & Teraspeed Consulting Group, received the John D. Moynihan Award for best paper. "Considerations for Capacitor Selection in FPGA Designs" explores the advantages of low-inductance capacitors.
The outstanding paper award went to Alan and Lambert Devoe of Presidio Components for "A New Feedback Filter Adhesive Which Produces Robust CTE Performance." The paper provides information on a new conductive epoxy material that eliminates cracks in feed-through capacitor assemblies.
Both papers are available for purchase at ECA's Digital Library: ec-central.org.
CARTS USA is a regional symposium for the passive electronic components industry. CARTS Europe will be held Sept. 25-28 in Bad Homburg, Germany, and CARTS Asia will take place Oct. 9-11 in Taipei, Taiwan.
Steve Weir, Steve Weir Design & Teraspeed Consulting Group, received the John D. Moynihan Award for best paper. "Considerations for Capacitor Selection in FPGA Designs" explores the advantages of low-inductance capacitors.
The outstanding paper award went to Alan and Lambert Devoe of Presidio Components for "A New Feedback Filter Adhesive Which Produces Robust CTE Performance." The paper provides information on a new conductive epoxy material that eliminates cracks in feed-through capacitor assemblies.
Both papers are available for purchase at ECA's Digital Library: ec-central.org.
CARTS USA is a regional symposium for the passive electronic components industry. CARTS Europe will be held Sept. 25-28 in Bad Homburg, Germany, and CARTS Asia will take place Oct. 9-11 in Taipei, Taiwan.
EDAConnect offers electronic design engineers an intuitive, easy-to-use connection from their EDA environment to their enterprise PLM system.
Provides an out-of-the-box software solution that protects the user from changes in either their EDA environment or enterprise PLM system. Its initial release provides integration for Mentor Graphics DxDesigner, Cadence Allegro and Agile. Additional EDA clients and PLM systems will be released as developed. Provides engineering with integrated library synchronization, design check-in and check-out, BOM extraction and comparison,
template driven design publishing and archiving, as well as an integrated view of the ECO process.
Offered in both site and enterprise licensing models to serve the needs of large and small organizations.
Perception Software, perceptionsoftware.com
A.C.E. Production Technologies introduces its KPH Series infrared (IR) preheat modules for the KISS102 Series Selective Soldering machine. KPH-10 and KPH-20 are simple to set up and use, and feature thermocouple ports to facilitate thermal profiling. KPH-10 offers a 10 x 24” heating area divided into two 10 x 12” individually-controllable zones of 750-watts each. KPH-20 offers a 20 x 24” heating area divided into four 10 x 12” zones.
Preheating drives out volatiles or moisture from the circuit board, minimizing the potential for delamination; it raises the overall temperature of the assembly and prevents thermal shock to the board, allows for faster processing, and reduces the potential for thermal shock and stress to the PCB.
Can operate in two separate modes: ‘Timer’ (times out at a specific setpoint) or ‘Ramp and hold’ (ramps to setpoint and holds that temperature). Following the preheat cycle, the operator manually advances the circuit board through the preheater into the KISS machine, where fluxing and soldering proceeds on a pre-heated board.
Available in benchtop or stand-alone configuration, product support rails line up with the rails of the solder wave.
Preheating drives out volatiles or moisture from the circuit board, minimizing the potential for delamination; it raises the overall temperature of the assembly and prevents thermal shock to the board, allows for faster processing, and reduces the potential for thermal shock and stress to the PCB.
Can operate in two separate modes: ‘Timer’ (times out at a specific setpoint) or ‘Ramp and hold’ (ramps to setpoint and holds that temperature). Following the preheat cycle, the operator manually advances the circuit board through the preheater into the KISS machine, where fluxing and soldering proceeds on a pre-heated board.
Available in benchtop or stand-alone configuration, product support rails line up with the rails of the solder wave.
A.C.E., www.ace-protech.com
LPKF Laser & Electronics has installed an LPKF UV laser processing system at Fine Line Stencil/A-Laser in Beaverton, OR.
LPKF MicroLine 600D is a next-generation UV laser capable of addressing a variety of tasks, including: cutting of flex circuits, cover layer cutting and skiving. It is also used for the machining of micro mechanical parts made of organic materials, such as polyimide and polyester.
LPKF Laser & Electronics, www.lpkfusa.com
FCT Assembly, fctassembly.com
LPKF MicroLine 600D is a next-generation UV laser capable of addressing a variety of tasks, including: cutting of flex circuits, cover layer cutting and skiving. It is also used for the machining of micro mechanical parts made of organic materials, such as polyimide and polyester.
LPKF Laser & Electronics, www.lpkfusa.com
FCT Assembly, fctassembly.com
Dual Rail Conveyor J204-53 optimizes manufacturing process equipment utilization, especially pick-and-place machines and high-volume, low- or medium-mix production. Production planning flexibility increases when the same process equipment can be used for both sides in double-sided SMD assembly or when two different products can be produced in single-sided production.
Transports and buffers PCBs between process machines, offers multiple-drive technology, eliminates contact between boards during transfer and features a safe, clean design with no visible motors or wiring. Sturdy structure offers reliable operation in demanding production conditions, and easy mechanical connection to other equipment.
Features steel frame construction, up to four individually driven conveyor segments on both conveyor rails, automatic indexing and inspection modes, Pb-free process compatible, PLC controller, start/stop/reset/emergency stop/inspection/send switches in membrane terminal, four standard frame lengths: 500, 1000, 1500, 2000 mm, SMEMA electrical interface, ESD-safe design and CE-safety compliant.
Transports and buffers PCBs between process machines, offers multiple-drive technology, eliminates contact between boards during transfer and features a safe, clean design with no visible motors or wiring. Sturdy structure offers reliable operation in demanding production conditions, and easy mechanical connection to other equipment.
Features steel frame construction, up to four individually driven conveyor segments on both conveyor rails, automatic indexing and inspection modes, Pb-free process compatible, PLC controller, start/stop/reset/emergency stop/inspection/send switches in membrane terminal, four standard frame lengths: 500, 1000, 1500, 2000 mm, SMEMA electrical interface, ESD-safe design and CE-safety compliant.
Elektrobit, elektrobit.com
Photo Stencil announces the results of Universal SMT Laboratories’ independent, extensive study, conducted in February 2006. The print-process study isolated the stencil alone to determine performance differences among a group of stencils manufactured by other stencil suppliers. Photo Stencil’s AMTX E-FAB stencil performed the best out of 12 stencils tested, provided by five different stencil manufacturers. The Xerox-authorized stencil manufacturer usse the AMTX Electroform stencil technology, licensed under U. S. Patents owned by Xerox and acquired by Photo Stencil in 1998.
The study included five electroform stencils and seven laser stencils, including Photo Stencil’s proprietary NicAlloy stencil. The report contains extensive data on the solder volume data for a range of SMT devices and aperture designs. Solder paste deposit heights, area and volume were measured for over 154,000 solder paste bricks. Solder paste volume and paste volume repeatability were measured for 16 SMT components in all 12 stencils. Both Pb-free and SnPb solder paste were used in the study. Stencils were ranked in paste volume delivery performance as well as paste volume repeatability. Photo Stencil’s E-FAB stencil provided the best paste transfer for both solder pastes among all stencils tested. NicAlloy was in second place for paste transfer.
The yield analysis program was used to determine the yield loss due to open defects of BGA and microBGA packages directly attributed to the stencil. The results show that compared to the best stencil, the increase in repair costs vary from an additional $658 for the second best to an additional $10,122 for the last place stencil. E-FAB provided the lowest rework cost for both solder pastes among all 12 stencils tested, with NicAlloy again coming in second.
The study included five electroform stencils and seven laser stencils, including Photo Stencil’s proprietary NicAlloy stencil. The report contains extensive data on the solder volume data for a range of SMT devices and aperture designs. Solder paste deposit heights, area and volume were measured for over 154,000 solder paste bricks. Solder paste volume and paste volume repeatability were measured for 16 SMT components in all 12 stencils. Both Pb-free and SnPb solder paste were used in the study. Stencils were ranked in paste volume delivery performance as well as paste volume repeatability. Photo Stencil’s E-FAB stencil provided the best paste transfer for both solder pastes among all stencils tested. NicAlloy was in second place for paste transfer.
The yield analysis program was used to determine the yield loss due to open defects of BGA and microBGA packages directly attributed to the stencil. The results show that compared to the best stencil, the increase in repair costs vary from an additional $658 for the second best to an additional $10,122 for the last place stencil. E-FAB provided the lowest rework cost for both solder pastes among all 12 stencils tested, with NicAlloy again coming in second.
For a copy of the full report, contact Dr. Coleman at 719-535-8528 or bcoleman@photostencil.com.
