Combines Model 9700 insertion machine with a high-speed, servo-driven x, y platform. Is fully automated, versatile and modular. Interchangeable applicator tooling offers several features that improve overall performance. Has computer-programmed self-teach insertion pattern feature, modular toolsets and compact size.
Features a 12 x 12" PC board capacity with dedicated or adjustable board fixturing options. Offers a machine cycle rate of over 5,000 insertions per hour with a compact design.
Zierick Manufacturing Corp., zierick.com
EP45HT MED is a two-component, heat-cured epoxy adhesive. Reportedly durable, tough and resistant to exposure to thermal shock and many chemicals. Can withstand long-term exposure form -80 to 500°F and has a glass transition temperature of >185°C. Adhesion to metals, glass, ceramics, wood, vulcanized rubber and many plastics is said to be excellent. The cured system works as an electrical insulator.
Specially formulated for use in the assembly of reusable medical devices. Can withstand exposure to repeated cycles of radiation, steam (autoclaving) and chemical sterilants. Meets the biocompatibility requirements of USP Class VI specifications.
Has a 100 to 30 mix ratio by weight and requires a minimum cure temperature of 250°F. Is 100% reactive and does not contain any solvents or diluents. Can be applied by brush, syringe or spatula. Available for purchase in pint, quart, gallon and five gallon container kits.
Master Bond Inc., masterbond.com
Highlighted systems at booth 2C01 include:
Camalot inline liquid dispensing system for low-to-medium production requirements. Ideal for SMT and hybrid applications, including glob top, solder paste, corner bond, gasketing and glue dotting functions. Features fast, accurate dispensing, up to 13,000 dots per hour; reliable construction with welded steel frame and cast aluminum gantry supports; and Camalot pump technology for process control.
Uses lead screws and servo motors (with closed-loop encoders) on all three axes to assure smooth, precise and accurate dispensing with an enhanced GUI.
With a 0.9 x 0.9 m footprint, and dispensing area of 254 x 254 mm. Options include a touch-probe z-axis sensor, hot plate and auto needle calibrator.
MPM AccuFlex stencil printer, for moderate-volume, high-mix printing, combines accuracy and flexibility in a compact footprint. Offers a range of options for future expansion. Designed for production of about 8,000 boards per week with two or more product changeovers per shift, handles boards from 3 x 2" to 23 x 20" and can print 12-mil pitch devices with consistent accuracy.
MPM Gel-Flex Tooling System supports the circuit board during stencil printing. Consists of non-conductive polyurethane elastomer gel enclosed in a durable membrane shell and mounted to a magnetic base. The compressible gel material provides gentle compliance to delicate bottom-side components and leads while providing support for the entire board surface. Available for AccuFlex, AP Excel, Ultraprint 2000 and UltraFlex BBP printers.
For local information contact Wei Feng, business manager, China:weifeng@speedlinetech.com.
Speedline Technologies Asia Pte Ltd., speedlinetech.com
Zurich, Switzerland -- DEK has developed a high-throughput backside wafer coating process, which is hosted on a mass imaging platform capable of exceeding the +/- 12.5 um total thickness variation (TTV) required by most wafer processing specialists. The process is compatible with underfill or adhesive-type coatings which are normally applied at a nominal 50 m thickness to the backside of semiconductor wafers prior to singulation.
“For any backside wafer coating process, TTV is the critical success factor,” said Clive Ashmore, global applied process engineering group manager. “With this latest application advancement, we are helping semiconductor packaging manufacturers increase throughput and reduce the cost per package by using high accuracy mass imaging.”
According to the company, the use of an optional wafer handler, flexible printing platform and reflow oven achieves more flexibility than dedicated backside coating machines. The system can be re-deployed for other processing requirements.
The backside wafer coating process is compatible with the company’s metal stencil and emulsion screen technologies. Metal stencils enable materials with larger filler particles, such as encapsulation materials, to be applied with a totally smooth surface finish. Mesh stencils allow other materials such as thermoplastic adhesives to be deposited accurately and at high speed. In each case, the capabilities of the machine and stencil technology are key to achieving control over the print thickness and ensuring uniformity at high volumes.
DEK, dek.com
Launched at the Semicon Europa show in April, two of the LDS3300 C models have already been delivered to the North American fab of a major semiconductor manufacturer. Additonal installations for this client are expected soon in European facilities.
“Conceived for perfect integration into automated fab lines, our new system combines micro and macro defect detection for all 300-mm wafer applications,” said Thomas Breser, strategic marketing & communications director. “This is an important part of why our client chose the LDS3300 C.”
As part of the automated macro inspection process, provides automated reticle and fuse inspection capabilities. High throughput (up to 130 wafers/hour) helps increase yield and reduce cost of ownership.
Focal plane analysis has high accuracy and efficiency in scanner focus calibration and monitoring, and scanner e-chuck flatness measurement and monitoring.
Leica Microsystems, leica-microsystems.com
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