FlexLink will introduce the following products at ATExpo:
DAS 30
DAS 30 (Dynamic Assembly System) is a modular factory concept platform for light assembly, inspection, test, repairing and packing applications. Covers simple assembly lines to highly ergonomic and automated logistic production systems. Combines flow-oriented production control and modular automation with ergonomic manual assembly solutions. Features include a modular reconfigurable construction, production control through RFID technology and dynamic buffering.
 
XK Pallet with RFID Integration
The XK conveyor system features a sturdy design and ample pulling power, allowing heavy work pieces to be transported and accumulated with accuracy even in hostile environments. Offers a range of standard divert/merge devices that enable the design of a pallet conveyor system with main conveyors and satellite conveyors. Capable of carrying loads up to 30 kg/pallet and up to 20 m/min. Offers production control with the integration of RFID technology directly into the pallets. This provides the ability to track and trace products on an individual basis. Drip trays on the conveyor beams are compatible with other drip catcher systems and are available for other divert/merge devices.
 
Automated Adjustable Guide Rail
Automated Adjustable Guide Rail allows products of different sizes to be run on the same line and eliminates the costs associated with resetting systems. Requires no manpower, will adjust to different-sized products in a matter of minutes. Plug-and-play unit offers two different heights and two different widths. There are no restrictions in terms of accessibility. Conveyors can either be made high, low or built-in. Has adjustment range of 34-192 mm/34-363 mm.
 
FlexLink , flexlink.com

RO-CONTROL software combines important functions for process evaluation and process control for reflow ovens. It simulates temperature profiles with different oven settings and enables the comparison with a profile reference from the solder paste library. Controls the reflow oven and assures quality.

The effect of different oven settings to the reflow profile can be studied in advance and parameters can be optimized without tests. The simulation program calculates the reflow profile from the zone temperatures, the conveyor speed and a PCB constant.

The simulated temperature profile can be compared with the guidelines of the solder paste manufacturer. The available solder paste library can be expanded by the user.

The real temperature profile on the PCB can be measured using two optional thermocouples. Measurements are shown graphically. For process analysis profile comparison the antecedent simulated profile and the solder paste reference can be superimposed.

ESSEMTEC AG, essemtec.com

 

 

 

AdVantis XS is designed for the convergence of semiconductor and standard surface-mount assembly, uses VRM linear motors for accuracy and repeatability.
 
Evolved from the company’s GSMxs, delivering accuracies of +/-9 microns at +/- 3 sigma, but with a reported 25% increase in feeder capacity and a 15% speed improvement. Advanced materials engineering and optimized design available at a price 25% lower than its predecessor.
 
Includes high magnification cameras, flip-chip algorithms, low force capability, heated spindles, fluxing, dispensing and a variety of feeder types. Is Class 1000 clean room compatible.
 
Universal Instruments, uic.com

Electronics engineers requiring the condensed system architecture in camera inspection and vision-aided robotics applications but needing the transmission performance available from larger connectors in Camera Link applications can take advantage of Shrunk Delta Ribbon (SDR) Connectors and 0.8 mm Cable Assemblies from 3M Electronics. 
 
Comprised of RoHS-compliant boardmount connectors and a variety of cable assemblies developed to address Camera Link and mini Camera Link (mini CL) interface requirements while offering signal integrity.
 
New connector provides a variety of SDR solutions for Machine Vision and CL applications that require a smaller form factor with high transmission speeds.
 
SDR Connector uses a ribbon contact system with a 0.8 mm contact pitch. SDR low profile, polarized boardmount connectors are constructed of high temperature plastic bodies with 30 micron gold contacts, stamped metal EMI/ESD interface, and come with installed jack sockets and supporting board mounting hardware.  The installed jack socket supports the corresponding assembly thumbscrew interface.
 
Boardmount products are offered in both vertical and right-angle RoHS-compliant PTH and SMT attachments.
 
SDR Cable Assembly consists of rugged, over-mold shells with a thumbscrew locking system.  Come in a variety of MDR/SDR configurations. Uses 28 AWG cable and wiring configurations that meet legacy CL specifications. Available in 30 AWG configuration upon request.
 
 
3M has added two features to its CL assembly offering for both MDR and SDR.  The first is an over-mold, right angle configuration that provides a low profile, thumbscrew interface which reduces the assembly profile by more than four inches compared to traditional straight-exit backshell options. The second is an extender assembly for adding length to existing cables or providing means for bulkhead/mid-span/pass-through requirements. Extender cables feature over-mold MDR receptacles.
 
 
3M Electronics, 3M.com