ASHBURN, VA – Zestron America will showcase its latest lead-free cleaning process solutions at booth 5609 during ATExpo from Sept. 27-29 in Rosemont, IL. The company will also feature its recent advances in PCB, stencil/misprint and maintenance cleaning applications.
The applications technology and sales team will be available to answer precision cleaning questions.
As part of the SMTA International technical session series, Zestron’s application technology manager, Umut Tosun, will discuss “Effective Flux Removal Under Stringent Environmental Limitations.” The presentation will take place on Sept. 27 at 1:30 in Room 5 during SMT2: Post Assembly Cleaning of the Circuit Board-New Concerns, Requirements and Developments.
Zestron America, zestronusa.com
The applications technology and sales team will be available to answer precision cleaning questions.
As part of the SMTA International technical session series, Zestron’s application technology manager, Umut Tosun, will discuss “Effective Flux Removal Under Stringent Environmental Limitations.” The presentation will take place on Sept. 27 at 1:30 in Room 5 during SMT2: Post Assembly Cleaning of the Circuit Board-New Concerns, Requirements and Developments.
Zestron America, zestronusa.com
DEK will launch the VectorGuard Nickel Laser Cut stencil range at ATExpo on Sept. 27-29. The event will include DEK’s high accuracy mass imaging solutions in booth 5400.
The stencils are designed to address the challenges presented by lead-free, accommodating the effects of changing paste rheology on aperture release characteristics. Said to deliver a high level of paste volume repeatability to optimize process yield and uniformity.
DEK representatives will provide lead-free advice to delegates wanting to learn more. Clive Ashmore, global applied process engineering group manager at DEK, will also be presenting a lead-free paper - Mass Imaging of Lead-Free Material.
DEK, dek.com
Haverhill, MA – Ultrasonic Systems’ Optima Fluxing System has an Ultra-Spray head that produces a more vertical spray pattern, ensuring through-hole penetration on the wide, thick circuit boards.
Can process boards up to 24” wide, over 0.200” thick and with plated through holes of 0.020” in diameter and smaller. Said to provide complete through-hole penetration, whether using VOC-free, no-clean or highly aggressive water-soluble flux.
Ultrasonic Systems, ultraspray.com
Can process boards up to 24” wide, over 0.200” thick and with plated through holes of 0.020” in diameter and smaller. Said to provide complete through-hole penetration, whether using VOC-free, no-clean or highly aggressive water-soluble flux.
Ultrasonic Systems, ultraspray.com
FRANKLIN, MA – Speedline Technologies will showcase MPM printers, an Electrovert reflow oven and wave soldering equipment at ATExpo booth 5710.
Speedline’s exhibit at the show will spotlight the following:
MPM AccuFlex printing system will be part of the live, working electronics assembly line. The printer is for moderate volume, high-mix printing. Combines accuracy and flexibility in a compact footprint, the printer offers a range of options for future expansion or advanced processes. Designed for production of 8,000 boards/week, with two or more product changeovers per shift.
MPM Accela printing system features parallel processing technology. Said to produce the most boards/hour of any industry printer – delivering raw throughput gains of 20 to 80% over competitors and generating more quality boards per hour. Designed for ease of use, features a new design and easy-to-use operator interface. Is well positioned for the challenge of lead-free assembly and increasingly complex boards.
Electrovert OmniExcel 7 is a lead-free capable, seven-zone, forced convection reflow oven. Features an advanced chamber design for balanced airflow with minimal turbulence, to improve heat transfer and reduce power and N2 consumption. Compared to other platforms, reportedly consumes up to 50% less power and 35% less nitrogen. Can be equipped with self-cleaning Flux Extraction Systems (FES), delivering a drop in maintenance intervals to once per month. OmniCheck monitoring system delivers a redundant check on process temperatures and conveyor belt, and provides both extensive data tracking and monitoring capabilities of the process parameters.
In addition Speedline will exhibit its Electrovert Quick-Change Solder Module equipped with the new UltraFill Nozzle.
Speedline Technologies, speedlinetech.com
Speedline’s exhibit at the show will spotlight the following:
MPM AccuFlex printing system will be part of the live, working electronics assembly line. The printer is for moderate volume, high-mix printing. Combines accuracy and flexibility in a compact footprint, the printer offers a range of options for future expansion or advanced processes. Designed for production of 8,000 boards/week, with two or more product changeovers per shift.
MPM Accela printing system features parallel processing technology. Said to produce the most boards/hour of any industry printer – delivering raw throughput gains of 20 to 80% over competitors and generating more quality boards per hour. Designed for ease of use, features a new design and easy-to-use operator interface. Is well positioned for the challenge of lead-free assembly and increasingly complex boards.
Electrovert OmniExcel 7 is a lead-free capable, seven-zone, forced convection reflow oven. Features an advanced chamber design for balanced airflow with minimal turbulence, to improve heat transfer and reduce power and N2 consumption. Compared to other platforms, reportedly consumes up to 50% less power and 35% less nitrogen. Can be equipped with self-cleaning Flux Extraction Systems (FES), delivering a drop in maintenance intervals to once per month. OmniCheck monitoring system delivers a redundant check on process temperatures and conveyor belt, and provides both extensive data tracking and monitoring capabilities of the process parameters.
In addition Speedline will exhibit its Electrovert Quick-Change Solder Module equipped with the new UltraFill Nozzle.
Speedline Technologies, speedlinetech.com
EFD introduces SN89/SB10.5/CU0.5 high-temperature, lead-free solder paste with a solidus temperature of 242ºC, 22°C delta above SAC. May be used for multiple-step component assembly where the component will later be attached to a PCB using SAC alloy.
With the lead-free deadline rapidly approaching, an alloy with a higher reflow temperature is necessary. Additional advantages include high tensile strength (~12,000 PSI), improved wetting properties compared to other lead-free alloys and a pasty range of 21ºC from 263º to 242ºC.
Available in all flux systems and alloy types II, III, IV and V.
EFD, efdsolder.com
With the lead-free deadline rapidly approaching, an alloy with a higher reflow temperature is necessary. Additional advantages include high tensile strength (~12,000 PSI), improved wetting properties compared to other lead-free alloys and a pasty range of 21ºC from 263º to 242ºC.
Available in all flux systems and alloy types II, III, IV and V.
EFD, efdsolder.com
Stanley Assembly Technologies will demonstrate threaded fastening, special engineered assembly tools and Cobotics material handling systems at the ATExpo, Sept. 27-29. New products include QPM small screwdrivers, Fastening Tool Center software, Omega touch screen interface for multiple QPM controllers and a new PSI controller with pulse tools. The company also introduced a 500 lb iLift; the 150 lb model will demonstrate overall capability.
Straight, push-to-start and angle screwdriver models offer clean, quiet and ergonomic fastening from 0.4 to 18 Nm. Other QPM models include angle, straight, hold and drive, crowfoot, tubenut and fixtured tools with rated torques from 2 to 2,000 Nm. QPM assembly systems can interface in many ways to manufacturing systems for tool programming and data management. Fastening Tool Center software enables enterprise-wide control and data analysis for QPM systems. The touch screen interface offers soft PLC capability and interface with as many as 36 QPM tools and controllers.
Stanley Assembly Technologies, StanleyAssembly.com
Straight, push-to-start and angle screwdriver models offer clean, quiet and ergonomic fastening from 0.4 to 18 Nm. Other QPM models include angle, straight, hold and drive, crowfoot, tubenut and fixtured tools with rated torques from 2 to 2,000 Nm. QPM assembly systems can interface in many ways to manufacturing systems for tool programming and data management. Fastening Tool Center software enables enterprise-wide control and data analysis for QPM systems. The touch screen interface offers soft PLC capability and interface with as many as 36 QPM tools and controllers.
Stanley Assembly Technologies, StanleyAssembly.com
Press Releases
- Saki to Highlight Advanced Inspection Innovation at 39th Nepcon Japan
- ViTrox Welcomes Gemaddis as a New Sales Channel Partner in France
- NCMS Releases White Paper: “Artificial Intelligence to Improve Supply Chain Resilience Throughout American Manufacturing”
- E-tronix Expands Team with Strategic Hires to Strengthen Technical Solutions Support in 2025