The OptiCon series AOI platform can inspect components on PCBs with an angled view by using a newly developed optics module. Can execute inspections in 45° angle from four directions. Uses telecentric imaging and high resolution.
The modular AOI platform enables individual configuration of OptiCon systems. Typical applications for Quattro angled view are the evaluation of hard to see solder joints and components (e.g. at J-lead pins of PLCC and SOJ models or SMT connectors) but major gains will be in next-generation components such as OFNs.
HARRISBURG, PA -- Tyco Electronics has introduced a low profile, single connector, microminiature RF interconnect to meet the demand for direct board-to-board connections.
Traditionally, board-to-board RF connections have been achieved with either two cable connectors or two board connectors with a third, spacer or bullet, between. Compression Coax Board-to-Board Blindmate product eliminates the need for multiple connectors – and their added cost – by offering a single connector assembly with spring-loaded contact. One side is soldered on the base circuit board surface and the other side mates directly on the opposite target board using applied spring pressure. One piece design offers an easy connection with large radial and axial misalignment, and eliminates the risk of breaking soldered connections when mating or un-mating.
Available in three different lengths for board spacing of 6.65, 10 and 14 mm, and is supplied in trays for easy pick-and-place compatibility. Has an operating temperature range of –40 to +125°C, impedance of 50 Ohms and can operate effectively at frequencies up to 6 GHz. Return loss is specified as a minimum –20 dB at frequencies up to 2.1 GHz. Tolerance against axial misalignments from the nominal board stacking height is ±1.0 mm for the 10 and 14 mm versions, and ±0.3 mm for the 6.65 mm version. Tolerance against radial misalignment is ±0.8 mm from centerline, in any direction, for all three versions. Target pads can be tin plated, or a gold-plated disc can be applied to the mating PCB.
Viscom’s high-speed S6056 AOI system will debut during Productronica in November. The system features parallel inspection of two PCBS with a double-track system.
Uses 4M sensor technology and EasyPro operating environment. Three different inspection concepts can be implemented, depending on the customers requirements. In addition to selective inspection using single or double-tracks, it also offers parallel inspection to meet very high throughput rate requirements. System configuration is fitted with a double-track and two sensor modules, permitting simultaneous inspection of two PCBs per transport lane. Has no size limitations on PCBs up to 457 x 355 mm. Integrated shuttle is available for the twin-track, on the input or output side, obviating the need for external switching points for single-line production. Has integrated switchgear cabinet with a hinged frame for ease of maintenance. Is lead-free capable – as ensured by algorithm rules-based analysis, which is capable of obtaining optimum results under even highly varying contrast conditions.
Viscom, viscom.de Productronica, Hall A2, Stand 475
Thermo Electron’s NITON Analyzers business unit has released a new version of software for its NITON XLt 797 portable XRF (x-ray fluorescence) analyzer. Version 4.4, enables users to establish thresholds for rapid screening of solder bars, circuit boards and their components, then displays pass or fail symbols for each regulated element.
Whether manufacturers are segregating Pb and Pb-free stock, performing due diligence testing to verify supplier certifications or controlling solder chemistry as part of process quality control, the analyzer and software allows companies to employ non-technical personnel for these critical tasks. Easy-to-use data entry includes a virtual keyboard and integrated barcode scanner.
Capable of storing more than 3000 legally defensible measurements for later download. All readings are encrypted to prevent accidental or intentional tampering with the analytical result, yet may be easily incorporated into database or spreadsheet packages for reference to the company’s manufacturing and/or quality control systems.
Microscan’s miniature mega pixel imager Quadrus MINI high-resolution imager offers true auto-focus for industrial product identification. It will be introduced at ATExpo, September 27 – 29, in Booth 5729.
In the past, to achieve adjustable focus in changing applications, the imager’s hardware had to be physically calibrated for each new symbol distance. When using the MINI, all the operator needs to do is plug it in.
“The MINI imager performs much like an off the shelf digital camera,” said Microscan president Dennis Kaill. “You point it at the object of interest, in this case the symbol, and push the EZ button. It automatically focuses on the symbol and sets the exposure time, gain and illumination intensity. ”
Designed for demanding, high performance applications in electronics manufacturing, it reads both linear bar codes and 2-D codes such as Data Matrix directly marked on boards and components. Ultra compact size (1.8” x 2.10” x 1”, weight less than 2 ounces) and high resolution optics provide a wide scan window.
Featuring a mega pixel sensor with an extra wide field of view and proprietary algorithms, reads long bar codes omni-directionally and high density 2-D symbols. Has auto-focus, EZ button setup and green flash good read indicator. Customizable data output and Windows’ based interface allows integration into existing platforms with minimal programming.
STOCKHOLM, SWEDEN – At Productronica booth A5:337, MYDATA automation will unveil the MY500 stencil-free printer.
The machine uses Jet Printing Technology to shoot volumes of solder paste at 500 dots/sec. (1.8 million dots/h).
Because it needs no stencils, operators can change the print program in a matter of seconds and can control the volume of solder paste deposits for each pad.
Other benefits to stencil-free production include: • No waiting for stencils to arrive from manufacturers • No stencil production costs • No hazardous solvents to clean stencils • Instant control over paste volumes on pads • Flexible programming possibilities • Reduction of errors associated with screen printers • Lower consumption of solder paste.
To develop the jet printing technology, the company teamed up with solder paste suppliers such as NIHON ALMIT Co. and Senju Metal Industry Co.